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Steven Wei Semiconductor Products Group. Efficient & Innovative Handset Components Solutions. Agenda. Introduction To Agilent Semiconductor Products Group Solutions For RF Front-End Devices Enablers for RF Front-End Integration E-pHEMT & HBT PA FBAR RF Front-End Integration

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Steven wei semiconductor products group

Steven WeiSemiconductor Products Group

Efficient & Innovative

Handset Components Solutions


Steven wei semiconductor products group

Agenda

  • Introduction To Agilent Semiconductor Products Group

  • Solutions For RF Front-End Devices

    • Enablers for RF Front-End Integration

      • E-pHEMT & HBT PA

      • FBAR

    • RF Front-End Integration

  • Solutions For Feature Phones

    • IRDA and Sensors

    • LED’s

  • Conclusions

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Steven wei semiconductor products group

SemiconductorProducts

Automated

Test

Life Sciences and Chemical Analysis

Test andMeasurement

$1.4 B

$0.9 B

$2.0 B

$2.9 B

Technology Synergy

Agilent Laboratories

Shared Infrastructure

Agilent Revenue - $7.2 Billion in FY04

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Steven wei semiconductor products group

Agilent Semiconductor Products Group

Market Focus

Mobile

Storage, Computing & Networking

Optoelectronics

  • Wireless Semiconductors

  • Mobile Imaging

  • Infrared / Sensor Products

  • Computing, Storage and Networking ASICs

  • Printer ASICs

  • Storage and Networking ASSPs

  • Fiber Optics Products

  • Optoelectronic Products

  • Isolation Products

  • Motion Control Products

  • Optical Navigation

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Consumer demand drivers

Consumer Demand Drivers

  • Cost, simplicity, size and fashion.

    • First and foremost, it’s a phone.

    • Increasingly it’s a digital consumer electronics product.

  • Increasing emphasis on visual communications.

    • Large color LCD screens with white LED backlighting.

    • Embedded cameras and LED flash lights.

    • Color phone housings and blue LED keypad backlighting.

  • Seamless connectivity.

    • Maximum geographic coverage and seamless roaming.

    • Ability to share information between personal and/orenterprise equipment (PAN/LAN/IR connectivity).

  • Value added functions.

    • Music, games, remote control, GPS, TV tuners etc.

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Steven wei semiconductor products group

Solutions for Mobile Communications

LED Flash

Higher quality pictures

CMOS Image Sensors

Camera functionality

IrDA + Remote Control, IRFM

Size advantage plus increased functionality

Front-End Modules

Size advantage and higher integration

Proximity Sensor

Automates speaker phone

E-pHEMT & HBTPower Modules

Extend battery life

Ambient Light Photo Sensors

Extend battery life

FBAR Filters

Size & performance

advantage

Navigation

Improved user interface

Color Chip LEDs

Improved aesthetics

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Market driver

3G

2G

2.5G

Bigger Color Display

Live Video

Full PDA Feature

Internet Terminal

Bigger Display

Music

Graphics

Some PDA Features

Voice / High Speed Data

Packet / IP Based

Voice

Circuit Switch

Voice / Data

Packet

RF

RF Front-End

W-CDMA

RF Front-End

GSM

RF Front-End

GSM

RF Front-End

W-CDMA

RF/IF (Radio)

  • Multi-Band

  • Multi-Mode

  • More Memory

    Flash 4MB -> 32MB

    SRAM 2MB -> 8MB

  • More MPU Power

  • Multi-Band

  • Multi-Mode

  • LAN/PAN/ALI

GSM

RF/IF (Radio)

GSM

RF/IF (Radio)

RF/IF (Radio)

Base-band

Base-band

Base-band

  • Camera

  • Bluetooth

  • Memory Card

  • GPS

  • More Memory

Base-band

GPS

RF/IF (Radio)

Base-band

Board Area

RF 45%

Base-band &

Digital 55%

RF 50%

Base-band 50%

RF 40%

Base-band & Digital 60%

RF Module or Radio Module

RF Chipset + RF Module

RF Chipset or Discrete

The Quest for Increased Feature and Functionality for Voice & Data Terminals Calls for Low Cost and Highly Integrated RF Front-End and/or Radio Modules.

Market Driver

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CMOS(130nm  90nm  65nm)

SiGe BiCMOS or

CMOS(250nm180nm130nm)

MCOB (Organic or LTCC)

GaAs, Filter, Passives

3G

Transceiver

RFIC

Duplexer

3G

AFEM / BB

FLASH RAM

Camera

Module

PA

RF FEM

Switch

Filters

Control

Rx RFIC

(Direct Conversion)

AFE

Companion

LSI

Wireless

Base-Band

Application

Processor

LCD

Display

Module

VCO / PLL

(Fractional N)

Tx RFIC

(Direct Mod and etc..)

PA

APC

Keyboard

Regulator

DC-DC

Power

Management

Battery

What’s RF FEM (Front-end Module)?

Evolution of

Module

Integration

Evolution CMOS Integration

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EnhancementmodepsuedomorphicHighElectronMobilityTransistor

A better GaAs Technology

integrated

matching

& bias

High Power Added Efficiency

increases talk time in phones(all standards) vs. competing technologies

High Linearity, High Band Width

excellent for both linear and polar EDGE implementations

superior for CDMA, W-CDMA

high-performance multi-band PAs

Excellent Low Voltage Operation

operates well down to 1 V

Enhancement Mode FET

single positive supply

Output stage

CDMA PCS-band power module

with lid removed

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Talk Time

  • Most Transmit Power Usage : -10 to 10 dBm

    • But, PAM is optimized for full power (28 dBm)

    • Poor efficiency in the mostly used power region

    • More than enough linearity in the low power region

The Technology- CDMA Power Usage Pattern

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Steven wei semiconductor products group

  • CoolPAM technology allows stage bypass without switches

    • Reduced insertion losses

    • Improved efficiency

    • Smaller die size

Agilent’s CoolPAM Circuit Topology

Digital Control Using

Series

Switching

4

1

1

4

No Switches!

Low

-

power mode

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The coolpam technology

- Comparison of Average Current

The CoolPAM Technology

Past

Present

Future Projection

Urban

160

Cool PAMTM

Suburban

136

140

Future Technology

Available Now !

118

120

105

100

89

Average current ( mA )

77

80

59

55

60

36

40

28

27

18

20

0

ConventionalPA

Smart PA

Analog Control

Stepped Vcc

Cool

PAM I

Cool

PAM II

Cool

PAM III

Source :

RFIC symposium 2003

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The coolpam technology1

The CoolPAM Technology

  • US PCS band Performance Comparison

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: physical limit

Agilent Value Proposition

The Talk Time Value of CoolPAM

Projected Talk Times (Hrs)

Measured Talk Time (minutes)

Output power

Common PAM

Cool PAM I

Cool PAM II

10dBm

205

232

237

16dBm

190

221

226

Projected Packet Data Transfer Times (Hrs)

Battery Capacity : 850mA·h

Tested with actual phone board for Verizon models

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FBAR

fo+3%

FBAR

fo+3%

FBAR

fo

FBAR

fo

FilmBulkAcousticResonators

Vibrating membrane

creates resonance

Breakthrough resonator technology displacing Surface Acoustic Wave (SAW) and ceramic dielectric filters

FBAR

Membrane

Miniaturized Filtering

Acoustic resonator yields very small, very thin products

Superior Electrical Performance

Steep roll-off, low loss from high kT2 * Q

High power handling (> 1 W) from bulk structure

Excellent for Integration

Low temperature coefficient allows co-location with hot PAs and ICs

Same thermal coefficient of expansion as silicon

Silicon-Based for Low Cost

Leverages Si processing; 6” wafer size

400 MHz to >10 GHz capability

Contact

Resonators are built

into a filter structure

CDMA PCS duplexer

Ceramic Solution:

5.5 x 5 x 24 mm

FBAR Solution:

5 x 5 x 1.4 mm

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Fbar product evolution

FBAR Product Evolution

FBAR Technology Introduction Phase

Ceramic Packaged PCS Duplexer and Tx BPF

HPMD-7904

ACPF-7001

3 x 3 x 1.1 mm3

5.6 x 11.9 x 1.9 mm3

ACMD-7401

ACPF-7002/3

PCS

1.6 x 2 x 1.0(Max) mm3

5 x 5 x 1.4(Max) mm3

New Products

Coming Soon

cell

PCS

WCDMA

2100

KPCS

3.8 x 3.8 x 1.4(Max) mm3

GSM RX QB

150 Ohm Dif-Dif

~0.8 mm sq,

<0.3m thickness

uCap Technology Introduction Phase

uCap MCOB PCS Duplexer and Tx BPF

FBAR Product Proliferation Phase

Agilent plans to introduce 4 new 3.8x3.8mm duplexers and uCap GSM QB filters to further widen Agilent’s market presence and establish strong presence in the RF filter market.

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In Development

W-CDMA 2100 FBAR Duplexer

Small Size

3.8 x 3.8 x 1.4(Max) mm

Excellent performance

Tx: I.L. 1 dB typ, 1.5 band edge; Tx Band Isolation > 50 dBRx: I.L. 1 dB typ, 2.0 band edge; Rx-band Isolation > 45 dB

Same proven reliability and power handlingas HPMD-7904 and ACMD-7401

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Front end integration partition cdma

Front-End Integration Partition - CDMA

“By-Technology” Partition

  • Notes:

  • Not showing all the details of all components being integrated.

  • This is only showing the potential next step and will not be the ultimate integration or partition roadmap.

“By-Band” Partition

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Agilent CDMA Front-End Module

RX

AFEM-7731

(5x8mm2)

FBAR uCap

Duplexer

5x5mm2

NEW

FBAR Duplexer

E-pHEMT Power Amp

Matching

SMDs

ANT

Mat-ching

Tx RFIN

E-pHEMT

Power Amp

4x4mm2

  • Combines Best-In-Class CDMA PA and Duplexer with optimized interface

  • Smaller Size (up to 50% board space savings)

  • Reduced Part Count (up to 65% parts count reduction, including passives)

  • Enhanced Radio Performance with guaranteed system level specs

    • High Effective PAE, which includes duplexer and matching loss

    • Low “Full-Duplex NF” for high sensitivity

    • Low “Tx Power at Rx” for STD test

  • Excellent Low Voltage Performance for DC-DC Converter operation

  • Less susceptible to Interference because the signal trance and reference ground plan are contained in the module.

  • Bulky and costly isolator is eliminated

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FBAR

Duplexer

E-pHEMT

Power Amp

ANT

Passive

OutputMatching

On-Chip

Inter-stage

Matching

Passive

Input

Matching

TX IN

Bias Network

Vcntl

Vdd2

Vdd1

Vbias

  • Specifications (Typical):

    TX: 1850-1910 MHz

    • Idd: 355mA (Pout= 24.5dBm) 95mA (Pout= 11.5dBm)

    • ACPR1: -55dBc

    • ACPR2: -60dBc

      RX: 1930-1990 MHz

    • Insertion Loss: 2.2dB

    • Noise Figure (Pout=24.5dBm): 3.6dB

      • Includes Rx-band noise from TX

    • TX power at Rx pin: -27.5dBm

AFEM-7731, PCS CDMA FEM (2-element)

RX

5x8x1.3mm3 MCOB Module

  • Product Description:

    1900MHz CDMA 2-element FEM

    Optimized COB (Chip On Board) module integrated E-pHEMTPA & FBAR duplexer

    • Product Features:

      • 3.4V Operation (3.2V min.)

      • Small size: 5 x 8 x 1.3 mm Package

      • High PAE(Low current, 355mA typ at max Pout)

      • Low Quiescent Current < 50mA

      • Fixed and Dynamic Bias Control

      • Can be biased from DC/DC converter

      • High Isolation Tx-Rx

        • Low Rx-band Noise Leakage @ Rx port

        • Low Tx-band Signal Leakage @ Rx port

      • No Isolator Required

      • Encapsulation Molded Lid

  • Production Shipping Now !

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RF front-end solutions Summary

There are many combinations of the bands and modes for new 3G handsets.

There are multiple options to partition the radio front-end for a given combination of bands and modes. This is a challenging situation for RF component suppliers. This may not be a big problem for Base-band and RFIC, since Moore’s Law will help integrate more functionalities on Silicon. However, RF front-end uses a MCOB (Molded Chip On Board) module to integrate multiple functionalities and different material.

RF front-end modules need to be carefully partitioned and integrated for reducing size, optimizing performance and also lowering cost.

Agilent owns GaAs E-pHEMT , HBT Cool PAM and FBAR as core technologies for the RF front-end building blocks, such as PAs, Switches and Filters for all the standards/bands.

Both Agilent’s PA and FBAR provides the best-in-class performance, and proven high volume manufacturing capability.

CDMA Tx Module (Integrated PA and Duplexer) has been developed and now in high volume production phase. It demonstrates the performance improvement by the optimized interface.

Next challenge is the integration of multiple W-CDMA and GSM RF front-end functionalities.

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IrDA Protocol Stack Software

Accelerates IrDA adoption and

implementation

1

2

3

4

5

6

7

8

9

*

0

#

Optical Touch Panel

Replaces hard key pads

Proximity Sensor

Automates speaker phone

Mini-Endec

Accelerates IrDA adoption

Extensive ProductOffering for Mobile Phones

UV Sensor

Increases phone feature

IrDA TransceiverSize advantage

Customised module

Remote control feature

IrFM

SIR+RC, FIR+RC, VFIR

Ambient Light SensorExtends battery life

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Remote Control

Financial Messaging

ConsumerApplications

Digital Imaging

Imaging appln in camera phones

  • Image exchange

  • Image archive

  • Image printing

Target Market Overview

Applications for Mobile Phones

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Agilent surface mount leds

Agilent Surface-Mount LEDs

  • Top 3 LED supplier

  • #1 in InGaN blue LEDs for backlighting

  • Wide range of package sizes and configurations

  • Full range of LED colors

    • Full spectrum of single-color LEDs

    • Bi-color and tri-color LEDs

  • High volume, low cost manufacturing; billions of LEDs shipped

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Agilent Camera Flash Module

SMW-C860, HSMW-C820

  • Ideal For Camera Phones

  • Very high brightness

  • Own IP position

  • ESD protection

  • Slim package size

  • 2 soldering terminals

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Applications

  • AF auxiliary light source for cameras

  • Red-eye reduction lamp Self-timer display

Preliminary Features

  • 8° Narrow Viewing Angle

  • Available in Red Orange color

  • Iv > 15cd @ 20mA.

  • Light up distance up to 3 meters

  • Max driving current : 50mA

  • Available in SMT Package

  • Package size: 4.8mm x 4.8mm x 5.3mm

Auto Focus Auxiliary LED (Future Product)

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Agilent Flexible Light Strip (Future Product)

  • IP by Agilent

  • Small in strip shape, LED on 2 side, Æ 1.5 mm, any custom length

  • Flexi and Bendable (optical clear silicone)

  • Easy for assembly

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LCD Backlighting

LCD

Right angle Mt: C110,C120,tricolor

Top Mt:C130, C191, C197, bicolor, tricolor

Indicator

  • Bicolors:

    C15x, C16x

    - Tricolor:

    C118, C115

Camera Flash

White :

HSMW-C820, C830

Decorative Lighting

Tricolor:

C118, C115

Your ONE STOP SHOP for

Cellular Phone Lighting !!

Keypad backlighting

Top Mt: C191,C197, C130

Reverse Mt: C265

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Steven wei semiconductor products group

Conclusion

  • Mobile phones have entered a powerful new upgrade cycle drivenby a transition from voice-centric todigital and imaging-centric features

  • However, consumers won’t sacrifice size, fashion and styling

  • Agilent’s innovative semiconductor solutionsdirectly deliver or help enable the new featuresthat consumers demand

  • Agilent compliments this strong portfolio of semiconductor solutions with worldwide leadership in mobile test

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