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ASICs for HiSpec and DeSpec

ASICs for HiSpec and DeSpec. Ian Lazarus NPG. Hispec and Despec. Concept. AIDA for DSPEC- the concept. Super FRS Low Energy Branch (LEB) Exotic nuclei – energies ~50-150MeV/u Implanted into multi-plane DSSD array Implant - decay correlations Multi-GeV DSSD implantation events

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ASICs for HiSpec and DeSpec

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  1. ASICs for HiSpec and DeSpec Ian Lazarus NPG

  2. Hispec and Despec

  3. Concept AIDA for DSPEC- the concept • Super FRS Low Energy Branch (LEB) • Exotic nuclei – energies ~50-150MeV/u • Implanted into multi-plane DSSD array • Implant - decay correlations • Multi-GeV DSSD implantation events • Observe subsequent p, 2p, a, b, g, bp, bn … decays • Measure half lives, branching ratios, decay energies … From Tom Davinson (University of Edinburgh)

  4. AIDA for DESPEC General Arrangement From Tom Davinson (University of Edinburgh)

  5. Instrumentation AIDA for DSPEC- Instrumentation • Large number of channels required, limited available space and cost mandate • use of Application Specific Integrated Circuit (ASIC) technology. • Capabilities • Selectable gain: low 20GeV FSR • : • high 20MeV FSR • Noise s ~ 5keV rms. • Selectable threshold: minimum ~ 25keV @ high gain ( assume 5s ) • Integral and differential non-linearity • Autonomous overload recovery ~ms • Signal processing time <10ms (decay-decay correlations) • Receive timestamp data • Timing trigger for coincidences with other detector systems • DSSD segmentation reduces input loading of preamplifier and enables • excellent noise performance. From Tom Davinson (University of Edinburgh)

  6. 1 Channel of DeSpec Implantation Detector ASIC with FPGA

  7. 128 Channel FEE Card for AIDA (DESPEC) 4096 channels 32 FEE cards- 256 ASICs (16 ch/ASIC, 8 per card) Virtex 4 FPGA Power Supplies and other components ASIC ADC ADC ASIC ADC ASIC ADC ASIC ADC ASIC Virtex 4 FPGA Fibre Driver (Laser) for Ethernet ADC ASIC ADC ASIC ADC ASIC 16ch ASIC 16 bit ADC Data processing and readout

  8. DeSpec Si Implantation detector prototype with FEE and DAQ

  9. Possibly Useable for HYDE? • Also wants high energy range (4GeV) • Also uses Si detectors • Close enough to carry on talking!

  10. July 2005 FEE ASICs meeting Why collaborate on ASICs and FEE? • Limited ASIC manpower- don’t waste it. • Limited FEE and DAQ manpower too. • Avoid duplication of design effort where 2 experiments need a similar ASIC • Common software for slow control and DAQ (reduced software effort for experiments) • Compatibility between experiments • Independent design reviews (increase the probability of a working ASIC).

  11. July 2005 FEE ASICs meeting Actions/decisions: • Up to Jun 2006: Make physicists aware of these discussions about ASICs and collect the outline specs as they emerge from draft TDRs to look for synergy. • Find NUSTAR ASIC designers and talk to them! • ASIC Technology lifetimes- the NP (& HEP) market is so tiny as to have no influence on the lifetime if ASIC processes. Just use best guess. (CCLRC & CEA both use AMS 0.35um CMOS process for analogue.) • ASIC design cycle (3 iterations) takes 3-4 years. Start soon with 12 months of consultation and specification. • Design a system, not just an ASIC (or FEE card).

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