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External micro-PIXE analysis of the metal deposition on a CMS pitch adapter PowerPoint PPT Presentation


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From the silicon sensor (fan-out side). To the readout electronics (fan-in side). Al. External micro-PIXE analysis of the metal deposition on a CMS pitch adapter.

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External micro-PIXE analysis of the metal deposition on a CMS pitch adapter

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External micro pixe analysis of the metal deposition on a cms pitch adapter

From the silicon

sensor(fan-out side)

To the readout

electronics

(fan-in side)

Al

External micro-PIXE analysis of the metal deposition on a CMS pitch adapter

M. Massi, L. Giuntini, M.E. Fedi, C. Arilli, N. Grassi, P.A. Mandò, A. Migliori, E. Focardi Dipartimento di Fisica and I.N.F.N., Firenze, Italy

The Compact Muon Solenoid (CMS) is one of the two multi-purpose detectors to be installed at the Large Hadron Collider (LHC), now under constructionat CERN, in Geneva, Switzerland.

The Pitch Adapter (PA) is a device situated between the silicon sensor and the front-end hybrid in the silicon tracker of the CMS experiment. Its purpose is to make the micro‑bonding connections possible between the input of the readout chips and the silicon sensor.

Part of pitch adapter

The PA consists in a fan of metallic strips engraved on a glass support; the strips consist in an aluminium coating (nominally  400 mg·cm-2) over a very thin chromium layer. Each strip ends with pads for the micro-bonding contacts.

Problems on micro-bonding in a pre-production series of PA…

1 mm

… might be explained assuming the presence of metallic contaminants in the aluminium deposition.

  • The Florence external micro‑PIXE facility appeared to be suitableto point out this kind of impurities:- good space resolution;

  • simple operation (external beam);

  • beam raster system integrated with a mechanical sample scan(system implemented by Oxford Microbeam Ltd.);

  • multi‑element capability and high sensitivity.

  • Measurement conditions:

  • proton beam energy of ~3 MeV;

  • current up to 1 nA on the target;

  • ~12 mm FWHM after 2 mm helium path.

Al

We analysedan overall 660x660 mm2 area:

Cu

Si

Cu

Si

the scanned area corresponds to 2x2 adjacent square maps of 360x360 mm2 (each obtained by beam scanning) with a 60 mm overlap for a safer linking of the individual beam scans.

The X-ray detection system consists in two Si(Li) detectors: one dedicated to lower energy X-rays (a helium flow was maintained in front of it) and the other optimised for the higher energy X-rays.

660 mm

660 mm

Optical microscope photograph and elemental maps of fan-in side

Optical microscope photograph and elemental maps of fan-out side

Cr

Cr

Coppercontaminates the depositions and it is absent outside; Silicon is clearly coming only from the substrate (no contamination is present in the deposited material); Aluminium is a major constituent of the deposit, but seems to be present also in minor quantity on the substrate, which is reasonable; Chromium is the “glue” between the glass support and the glass deposition.

We quantified the Cu contaminant from the spectra pertaining to selected sub-areas corresponding to the pads, by comparison to

a thin standard and neglecting matrix effects in the metal deposit.

The mean copper areal density comes out to be around

180 mg·cm-2.

Contamination from the target holder of the electron gun?

We also analysed a “good” PA from a different batch, on which the micro-bonding connections had resulted to be satisfactory: we detected no copper in the pads (having a sensitivity limit lower than 0.2 mg·cm-2).

The role of copper in the micro-bonding problems is clear.

BY OUR EXTERNAL MICRO-PIXE SET-UP WE HAVE BEEN ABLE TO IDENTIFY THE CAUSE OF UNRELIABILITY OF A DEVICE TO BE EXTENSIVELY USED IN LHC EXPERIMENTS AT CERN


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