Because of equipment availability cost and time we will use aluminum as the top side conductor
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Because of equipment availability, cost, and time, we will use aluminum as the top side conductor. Top Side Conductor vacuum deposition Aluminum sputter deposit in Argon plasma. CVC 601-sputter deposition tool.

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Because of equipment availability, cost, and time, we will use aluminum as the top side conductor

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Because of equipment availability cost and time we will use aluminum as the top side conductor

Because of equipment availability, cost, and time, we will use aluminum as the top side conductor


Top side conductor vacuum deposition aluminum sputter deposit in argon plasma

Top Side Conductor vacuum deposition Aluminum sputter deposit in Argon plasma

CVC 601-sputter deposition tool


Because of equipment availability cost and time we will use aluminum as the top side conductor

A conductor metal is vacuum deposited on to the waferBecause of cost and equipment, aluminum will be used instead of silver

Sputtered aluminum


Photolithography

Photolithography

  • Photolithography is the transfer of patterns, circuits, device structures, etc. to a substrate or wafer using light and a mask or stencil to stop the light.

  • Photolithography is used extensively in the progression of microelectronics.

  • Today, because of the sizes involved in current computer microprocessor devices, other methods like direct patterning using electron beams are used.

  • Photolithography is still used for dimensions down to about 0.5um. The wavelength of UV light is .35-.45 um.


Top side conductor grid needs to be designed

Top side conductor grid needs to be designed

Pattern is created on a transparency sheet to keep cost low

Once top side conductor grid is finalized, a chrome on glass professional mask can be made


Typical top side conductor because of tester limitations 100ma cell size to be 10 cm 2 max

Typical top side conductor Because of tester limitations (100mA) – cell size to be 10 cm2 max


Uv light sensitive material called photoresist is spin coated on to the conductor side of he wafer

UV light sensitive material called photoresist is spin coated on to the conductor side of he wafer


Because of equipment availability cost and time we will use aluminum as the top side conductor

Wafers are spin coated with Shipley 1813 UV sensitive photoresistspin coating produces a uniform coating

Spin speed is set here

Light sensitive material is stored in amber dropper bottles – Use 1813

A vacuum chuck holds the wafer


Transparency is used as a photomask

Transparency is used as a photomask

Cells can be of various sizes but must line up for saw cutting


Because of equipment availability cost and time we will use aluminum as the top side conductor

The antenna design, arrayed on a transparency sheet, is placed on top of the wafer. This transparency is called a photo mask. Production photo masks would be made on glass plates with high precision patterns.


Ultraviolet light is projected down on to the photoresist coated wafer

Ultraviolet light is projected down on to the photoresist coated wafer


Because of equipment availability cost and time we will use aluminum as the top side conductor

HTG mask aligner and UV light sourceThe UV light source is a mercury vapor lamp at 436nm wavelength

UV light with filter surrounding it

Clear glass plates are used to make sure the transparency lays flat to the wafer

Exposure time set on timer

Wafer is held by vacuum, mask is placed on top and brought into contact with wafer


The wafer is developed leaving photoresist where no uv light has penetrated the mask

The wafer is developed, leaving photoresist where no UV light has penetrated the mask


Solitec automatic developer

Solitec automatic developer

Vacuum switch

Start switch


The conductor is disolved etched with the appropriate chemical

The conductor is disolved (etched) with the appropriate chemical


Aluminum is etched using the aluminum etchant at about 75 0 c

Aluminum is etched using the aluminum etchant at about 750C

Aluminum etch


After etching the top conductor grid pattern will be left on the wafer

After etching, the top conductor grid pattern, will be left on the wafer

Top conductor

Top side conductor complete


Once the top side conductor grid is complete the back side conductor can be deposited

Once the top side conductor grid is complete, the back side conductor can be deposited

For this fabrication run, aluminum will also be sputtered as the back side contact


Assignment

Assignment

Complete your top side conductor grid pattern and submit


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