Heterogeneous integration
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Heterogeneous integration. Presenter : Chia-Min Lin (9535811). Outline. Motivation Introduction Design concept / Fabrication process Results Conclusion Reference. Motivation. Y. – C. Tung et al., J. MEMS, 2005. Introduction. Pick/place method Connector/socket technique.

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Heterogeneous integration

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Heterogeneous integration

Heterogeneous integration

Presenter : Chia-Min Lin (9535811)


Outline

Outline

  • Motivation

  • Introduction

  • Design concept / Fabrication process

  • Results

  • Conclusion

  • Reference


Motivation

Motivation

Y. –C. Tung et al., J. MEMS, 2005


Introduction

Introduction

Pick/place method

Connector/socket technique

SAM technique to

assemble the LED

X. Xiong et al., J. MEMS, 2003

K. Tsui et al., JMM, 2004


Introduction1

Introduction

Self-assembly, transfer, integration

Low melting point solder

T. Kraus et al., Adv. Mater., 2005

H. O. Jacobs et al., Science, 2002


Design concept fabrication process

Design concept / Fabrication process

Liftoff technique

H. Onoe et al., MEMS’07, 2007

Stamp transfer technique


Aligning and loading mechanism

Aligning and loading mechanism


Results liftoff technique

Results – Liftoff technique


Results stamp transfer technique

Results – Stamp transfer technique


Yield and position accuracy

Yield and position accuracy


2d and 3d stacking of structures

2D and 3D stacking of structures


Bridge structure

Bridge structure


Si transfer to glass

Si transfer to glass

M. A. Meitl et al., Nature materials, 2006


Conclusion

Conclusion


Thanks for your attention

Thanks for your attention !


Reference

Reference

  • Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, and Isao Shimoyama, ”3D integration of heterogeneous MEMS structures by stamping transfer,” 20th IEEE MEMS Conference, Kobe, Japan, 2007, pp175-178.

  • Hiroaki Onoe, Eiji Iwase, Kiyoshi Matsumoto, and Isao Shimoyama, ”Three-dimensional integration of heterogeneous silicon micro structures by liftoff and stamping transfer,” J. of Micromech. and Microeng., 17, pp1818-1827, 2007.

  • Kenneth Tsui, Aaron A Geisberger, Matt Ellis ,and George D Skidmore, “Micromachined end-effector and techniques for directed MEMS assembly,” J. of Micromech. and Microeng., 14, pp542-549, 2004.

  • Xiaorong Xiong, Yael Hanein, Jiandong Fang, Yanbing Wang, Weihua Wang, Daniel T. Schwartz, and Karl F. Böhringer, ” Controlled Multibatch Self-Assembly of Microdevices,” J. of Microelectromech. Syst., 12, pp117-127, 2003.


Reference1

Reference

  • Yi-Chung Tung, and Katsuo Kurabayashi, “A single-layer PDMS-on-silicon hybrid microactuator with multi-axis out-of-plane motion capabilities-part II: fabrication and characterization,” J. of Microelectromech. Syst., 14, pp558-566, 2005.

  • Heiko O. Jacobs, Andrea R. Tao, Alexander Schwartz, David H. Gracias, and George M. Whitesides, ” Fabrication of a Cylindrical Display by Patterned Assembly,” Science, 296, pp323-325, 2002.

  • Tobias Kraus, Laurent Malaquin, Emmanuel Delamarche, Heinz Schmid, Nicholas D. Spencer, and Heiko Wolf, “Closing the Gap Between Self-Assembly and Microsystems Using Self-Assembly, Transfer, and Integration of Particles,” Adv. Mater., 17, pp2438-2442, 2005.’

  • Matthew A. Meitl, Zheng-Tao Zhu, Vipan Kumar, Keon Jae Lee, Xue Feng, Yonggang Y. Huang, Ilesanmi Adesida, Ralph G. Nuzzo, and John A. Rogers, “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Materials, 5, pp33-38, 2006.


Design concept

Design concept

F1~0

F2=kPDMS x APDMS k:coefficient of bonding energy

F3=ksubstrate x Asubstrate A:contact area


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