Foundry Certified Cadence DFM Turnkey Service

1. Foundry Certified Cadence DFM Turnkey Service Signoff Seminar November 2013 Rudy Mason- Senior Staff Application Engineer – VCAD

2. Background • Litho Process Check (LPC) is required for TSMC 28nm process nodes and below and is recommended at larger process nodes • Chemical Mechanical Polishing check (VCMP) is recommended for TSMC 45nm, 40nm and 28nm process nodes • Cadence DFM Service is customized to the customer’s needs and scheduled to provide fastest turn-around for LPC or VCMP checks. Analysis can be performed on • Early design data • Close to tapeout design data • Final tapeout data

3. DFM IntroductionDRC clean is not sufficient Litho • Litho process check (LPC) • Problem: Some DRC-clean layouts do not print on silicon • Solution: Must-have litho hotspot detection and fixingof design with foundry-certified tools • TSMC certified tool: Litho Physical Analyzer • Chemical-Mechanical Polishing (CMP) • Problem: Copper erodes during CMP stepand leads to yield loss and reliability issues • Solution: Must-have CMP hotspot detectionand fixing using foundry-certified tools • TSMC certified tool: Cadence CMP Predictor CMP Erosion Oxide Loss Dishing Total Copper Loss Foundries demand that new DFM verification standards are met by the customer prior to agreeing to manufacture IsolatedThin-Lines IsolatedWide-Lines Dense ArrayThin-Lines Dense ArrayWide-Lines

4. Cadence LPC Service (Litho Process Check) • Cadence will analyze customer’s GDSII database with production proven Litho Physical Analyzer (LPA) software to ensure layout meets TSMC’s DFM requirements for Lithography Process Check • Customer data must be DRC clean • Cadence LPA is qualified by TSMC to simulate the actual resist shapes created at each photo step on all critical mask layers • LPA is TSMC's golden engine for 40nm and 28nm • LPA has been the first to qualify at TSMC 65-28nm nodes, • LPA is used in the TSMC ISF flows • Hotspots identified by LPA like pinch and bridge patterns may pass DRCs, but are known to pose yield issues that can be avoided

5. Cadence CMP Service • Cadence will analyze customer’s GDSII data base with production proven Cadence CMP Predictor (CCP) software to ensure layout meets all TSMC’s DFM requirements for VCMP check. • CCP simulates the interconnect copper thickness over customer’s layout. • Cadence CMP Predictor tool is qualified by TSMC and uses the latest available DDKs (DFM Data Kits) and engines to simulate TSMC’s CMP process • Hotspot locations that will not meet required thickness control specifications are detected and fed back to the customer to improve the layout

6. Benefitsof Cadence DFM Services • Sign-off analysis compliance: ensures compliance to TSMC DFM checking mandate • Lowest total cost of ownership: No investment in software tools, multi-CPU infrastructure and learning of new tools • Efficient access: provides priority turnkey access to TSMC Golden DFM analysis both prior to and at tape-out • Reduced schedule risk: allows the customer to verify DFM compliance early with an Initial Top Level GDSII run • Optimal time-to-results: harnesses 50-100 dedicated CPUs/run in our server farm for fast turn-around time • Security: leverages a highly reliable and state-of-the-art IT and security infrastructure which ensures protection from unauthorized access. • Leverage Cadence expertise: leverages team with many man years of experience and combined resources of Cadence Design Services and R&D • Low risk learning experience: provides a learning experience for designers to understand DFM while designing with advanced process nodes • Automated repair:Output report enables automated fixing of LPC hotspots in Cadence Encounter or Virtuoso implementation flows

7. LPC Service Solution • Customer provides Initial Top Level GDSII database • Cadence performs LPA analysis to meet TSMC’s LPC requirements • Deliverables LPC Output: • Hotspot locations and level of severity reported after each run with guidelines for modifying layout to remove the highest priority yield detractors. • Output files enable auto fixing with Cadence Encounter or Virtuoso implementation flows • Comprehensive report file for the foundry Consultation as needed to fix the yield detractors • The Updated Top Level GDSII database with “fixes” will be run again to confirm LPC DFM compliance

8. CMP Service Solution • Customer provides Initial Top Level GDSII database • Cadence performs CMP analysis to meet TSMC CMP requirements • Deliverables CMP Output: • Metal density distribution (heat map) and histogram chart • Metal thickness distribution (heat map) and histogram chart • Hotspot locations with type of errors Consultation as needed to fix the yield detractors • The Updated Top Level GDSII database with “fixes” will be run again to confirm CMP DFM compliance

9. Customer Provided Data • Customer provides GDSII/OASIS input for each DFM Analysis • FTP compressed, encrypted GDSII/OASIS to a secure Cadence drop-box (Data should be DRC clean with respective log information) • Identification of all technology information, process options, and CAD layers should be included • Required GDSII layers • LPC: OD, PO, CO, M1, VIAx and all Mx • CMP: M1, all Mx, My, Mz, Mr

10. Summary • Cadence’s provides end-to-end TSMC certified DFM sign-off analysis which ensures compliance to TSMC’s DFM recommendation • Over 75 DFM runs completed so far • Offers a secure and risk-free alternative to in-house DFM signoff and complements efficiently in-Design DFM Analysis • Cadence provides expertiseleveraging TSMC certified tools, methodologies, processes and use models to provide the fastest turnaround time • Can be combined with In-Designtool solution for block screening