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Paolo Musico on behalf of TOPEM collaboration

The Endo-Rectal probe prototype of the TOPEM project. 3-7 September 2014 - Porto Conte – Alghero (I). Paolo Musico on behalf of TOPEM collaboration. I.N.F.N . Genova – via Dodecaneso , 33 – 16146 – GENOVA (Italy ). Abstract

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Paolo Musico on behalf of TOPEM collaboration

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  1. The Endo-Rectal probe prototypeof the TOPEM project • 3-7 September 2014 - Porto Conte – Alghero (I) Paolo Musicoon behalf of TOPEM collaboration • I.N.F.N. Genova – via Dodecaneso, 33 – 16146 – GENOVA (Italy) Abstract The TOPEM project was funded by INFN with the aim of study the design of a TOF-PET system dedicated to prostate imaging. During last year a big effort was put into building the prototype of the endo-rectal probe from all point of view: mechanical, thermal, electrical. A dedicated integrated circuit was adopted to have the minimum dimensions: the TOFPET Asic. The system is composed by a LYSO pixellated crystal is seen by a 128 SiPM matrix on both surfaces: this permits a DOI measurement. The 4 needed ASIC are handled by a FPGA board which transmit data over an UDP connection. The external container was made using 3-D printing technology: internal channels on the external surface permit the flowing of controlled temperature (≈ 35 ºC) water. Electronic components power is dissipated using an internal air flow kept at lower temperature (≈ 20 ºC). The probe is MR compatible: a dedicated small antenna can be accommodated in the container. This will permit simultaneous imaging in MRI and PET systems. • TOFPET Asic • Low power, low noise SiPM readout ASIC for Time of Flight applications • 64 channels high performance TDC • 25 psr.m.s. intrinsic time resolution • Time Over Threshold charge measurement • Dynamic range: 300 pC • Max channel hit rate: 100 KHz • SiPM positive and negative polarity, up to 320 pF terminal capacitance • On-chip calibration circuitry • Output data rate: 160, 320, 640 Mb/s • CMOS 130 nm technology, 25 mm2 silicon die • One pad-free edge to allow abutting two twin chips into a 128-channel BGA package. • LVDS digital interface • Joint development INFN – LIP • Used naked components and built a dedicated hybrid circuit with chip on board (COB) technology • First measurements in this system: TOT versus calibration charge (raw data) Probe test bench Ethernet connection USB connection FPGA Board Complete probe electronic system Rigido-flex circuits 0.3 mm pitch ZIF connectors TOFPET Asic Probe head detail Upper SiPM:S11828‐3344M LYSO mockup LYSO thickness: 13 mm Overall thickness: 25 mm Lower SiPM:S10493-1373(X) TOFPET Asic Cabled probe inserted in the container External container details Water channels` Fixing holes Water Inlet and Outlet Container length = 105 mm Internal diameter = 32 mm External diameter = 37 mm

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