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NA62 Gigatracker cooling requirements. Gigatracker (GTK) modules will operate in vacuum and under high radiation Module has to be replaced on a regular basis C ooling system required to avoid performance loss

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na62 gigatracker cooling requirements
NA62 Gigatrackercoolingrequirements
  • Gigatracker (GTK) modules will operate in vacuum and under highradiation
  • Module hastobereplaced on a regularbasis
  • Cooling system required to avoid performance loss
  • The operation temperature for thefrontendelectronics will be 5°C orlower
  • Low material budgetforthecoolingsystem
gigatracker module
Gigatracker Module

supportandalignementstructure

Coolingplate

Readoutchip

(12.5 x 20 mm), heatproduction ca. 3.2W per chip (2 W/cm2)

beam direction

Sensor, siliconpixels

(27 x 60 mm)

3D schematicdrawing of the GTK module

materials in the sensor area
Materials in thesensorarea

The total material budget (material in the beam) allowedfor the GTK module is 0.5% X0(radiation length).

cooling systems under investigation
Coolingsystemsunderinvestigation
  • carbonplate, conductivecooling
  • convectivecooling in a vessel
  • microchannels
our proposal microchannel cooling
Ourproposal: Microchannelcooling
  • Goals ofdevelopment:
  • Integration ofmicrochannelsintofrontendelectronics
  • Cooling via an separate coolingplatewithmicrochannels
    • 150mm thickness
    • 300mm thickness
  • Benefits:
  • Uniform temperaturedistribution in theareatobecooled
  • Small DT betweencoolantandreadoutchip => reduced thermal stress
  • Single-phaseandtwo-phasecoolingpossible
  • Technology studiedat EPFL with strong supportofindustrialpartners
  • Mutual understandingtoshareknowledge (EPFL <> CERN)
  • Specifityofourapplication:
  • Verylow material budget
  • Low heatflux
tentative layout of micro channels for the gigatracker
Tentative layoutofmicrochannelsfortheGigatracker
  • areatobecooled ~40 x 60mm
  • channellength ~40mm
  • channelcrosssection 50mm x 50mm
  • separationwalls 25mm thick
  • heatflux in thecoolingregion 2W/cm2
  • Support and Connection ofservicesoutside the sensor area and on one side
  • Single-phasecooling
  • Open pointsforthe prototype:
  • U-shapedchannelsorsinglelinechannels (pressureloss <> massflowneeded)
  • Thermal connectionofthereadoutchiptothecoolingplate
c 6 f 14 cooling liquid of choice
C6F14 cooling liquid ofchoice
  • radiationhard
  • thermallyandchemicallystable
  • nonflammable, nontoxic, nonconducting
  • knownandusedat CERN (CMS and Atlas Tracker)
  • used in liquid phase
more people for the gtk cooling
More peopleforthe GTK cooling

Paolo Petagna, CERN PH-DT-PO, DT cooling Project Leader

Alessandro Mapelli, EPFL Mircrosystems Laboratory, Microfabricationtechnologies

Piet Wertelaers, CERN PH-DT-PO, Consultant for design andlayoutofcoolingcircuit

JerômeDaguin, PH-DT, Experience in C6F14plantsat CERN

plans for the next months
Plans forthenextmonths

August/September:

  • firstlayoutforthemicrochannels
  • productionof a prototype atthe EPFL clean room
  • preparation teststand (coolingunit, instrumention …)
  • design ofconnectingcomponent
  • developmentof a CFD-Model

Oktober/November:

  • commissioning teststand
  • firsttestatroomtemperature
  • preparationoftestatcoldtemperature, cryostat
  • assembly prototype andmockupchips

Thermal interfacetobedesignedaccordingtochip design andfabrication!!!

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