Post dac towards loi
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Post-DAC Towards LOI. DAC review was very favorable Encouraged to seek DOE construction funds To get on mass-shell for possible DOE FY05 construction $ we need to submit LOI to DOE by March 03 include summary of LOI in BNL FWP, Feb 24 DOE $ may or may not be there

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Post-DAC Towards LOI

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Post dac towards loi

Post-DAC Towards LOI

  • DAC review was very favorable

  • Encouraged to seek DOE construction funds

  • To get on mass-shell for possible DOE FY05 construction $ we need to

    • submit LOI to DOE by March 03

    • include summary of LOI in BNL FWP, Feb 24

  • DOE $ may or may not be there

    • capital expenditure is a possible “replacement” of AEE line


Post dac towards loi

LOI

  • Physics-case, performance, technology, schedule / budget

  • Boundary conditions

    • cost to DOE < $5M, starting FY05

    • cost to RIKEN, $3M starting JFY04 (April ’04?)

  • Key decisions to be made before LOI deadline

    • what can be built for < $8M

    • what de-scoping maintains the most physics


Process

Process

  • Three parallel tracks of work for next weeks

    • cost estimates for everything (next slides)

    • which combinations are feasible constrained by costs, boundaries

      • e.g. barrel largely via RIKEN, endcap via DOE

      • two staged DOE projects, e.g. first $5M towards barrel, 2nd later $xM for endcaps

    • commitments from groups to say what they will work on

  • Weekly Si meetings, weekly reports to Phenix management, finally a DC meeting?


Immediate task

Immediate Task

  • Estimate costs, valid at LOI level, but these have a long-life….

  • Two paths: individual items and scaling from comparable projects

  • Costs for all construction items

    • both RIKEN/DOE estimates to figure out how to spend $8M

    • separate out R&D costs and construction costs

      • i.e pre FY05 and post FY05 costs

  • R&D $ and leverage of other $, e.g. LDRD ORNL, LANL

    • match possible construction plan, e.g. possible application of LANL LDRD towards endcap electronics

  • First report next Thur 23,7pm

    • first report due in to Phenix management Fri Jan 24

    • list of proposed responsibilities next page


Costs

Costs

  • Mechanical, Dave Lee, Hideto

    • both HYTEC or in-house engineers (BNL/RIKEN)

  • Si strips, sensors Yuji

  • Si strips, readout (SVX4) + FEM->Phenix, Vince

  • Si pixel barrel ALICE1 sensor+hybrids+bump+thinned via VTT, Yuji

  • Si pixel barrel LHCBPIX1 sensor+hybrids+bump+thinned via FNAL, Craig O

  • Si pixel FEM->Phenix, Axel

  • Si pixel-endcaps, sensor+hybrids non-thinned, Pat/Dave

  • Beam-pipe, Dave

  • Systems integration, slow controls, Craig W?

  • Scaled from comparable systems, Craig O


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