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Post-DAC Towards LOI. DAC review was very favorable Encouraged to seek DOE construction funds To get on mass-shell for possible DOE FY05 construction $ we need to submit LOI to DOE by March 03 include summary of LOI in BNL FWP, Feb 24 DOE $ may or may not be there

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post dac towards loi
Post-DAC Towards LOI
  • DAC review was very favorable
  • Encouraged to seek DOE construction funds
  • To get on mass-shell for possible DOE FY05 construction $ we need to
    • submit LOI to DOE by March 03
    • include summary of LOI in BNL FWP, Feb 24
  • DOE $ may or may not be there
    • capital expenditure is a possible “replacement” of AEE line
slide2
LOI
  • Physics-case, performance, technology, schedule / budget
  • Boundary conditions
    • cost to DOE < $5M, starting FY05
    • cost to RIKEN, $3M starting JFY04 (April ’04?)
  • Key decisions to be made before LOI deadline
    • what can be built for < $8M
    • what de-scoping maintains the most physics
process
Process
  • Three parallel tracks of work for next weeks
    • cost estimates for everything (next slides)
    • which combinations are feasible constrained by costs, boundaries
      • e.g. barrel largely via RIKEN, endcap via DOE
      • two staged DOE projects, e.g. first $5M towards barrel, 2nd later $xM for endcaps
    • commitments from groups to say what they will work on
  • Weekly Si meetings, weekly reports to Phenix management, finally a DC meeting?
immediate task
Immediate Task
  • Estimate costs, valid at LOI level, but these have a long-life….
  • Two paths: individual items and scaling from comparable projects
  • Costs for all construction items
    • both RIKEN/DOE estimates to figure out how to spend $8M
    • separate out R&D costs and construction costs
      • i.e pre FY05 and post FY05 costs
  • R&D $ and leverage of other $, e.g. LDRD ORNL, LANL
    • match possible construction plan, e.g. possible application of LANL LDRD towards endcap electronics
  • First report next Thur 23,7pm
    • first report due in to Phenix management Fri Jan 24
    • list of proposed responsibilities next page
costs
Costs
  • Mechanical, Dave Lee, Hideto
    • both HYTEC or in-house engineers (BNL/RIKEN)
  • Si strips, sensors Yuji
  • Si strips, readout (SVX4) + FEM->Phenix, Vince
  • Si pixel barrel ALICE1 sensor+hybrids+bump+thinned via VTT, Yuji
  • Si pixel barrel LHCBPIX1 sensor+hybrids+bump+thinned via FNAL, Craig O
  • Si pixel FEM->Phenix, Axel
  • Si pixel-endcaps, sensor+hybrids non-thinned, Pat/Dave
  • Beam-pipe, Dave
  • Systems integration, slow controls, Craig W?
  • Scaled from comparable systems, Craig O
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