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Thermal Analysis of an Icy IC

Thermal Analysis of an Icy IC. Shiree Burt Cryogenic Electronics Group San Francisco State University Presented October 2, 2006 Revised October 18, 2010. Page 1. Page 2. Two processes for releasing the silicon nitride membrane:. Thin PolySi Removed by XeF 2. Page 3.

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Thermal Analysis of an Icy IC

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  1. Thermal Analysis of anIcy IC Shiree Burt Cryogenic Electronics Group San Francisco State University Presented October 2, 2006 Revised October 18, 2010

  2. Page 1

  3. Page 2

  4. Two processes for releasing the silicon nitride membrane: Thin PolySi Removed by XeF2 Page 3

  5. Confinement of XeF2 etch by SiO2 etch stop “tub” With Etch Stop Without Etch Stop Page 4

  6. Membrane Undercutting Test Structure Page 5

  7. Page 6

  8. Page 7

  9. Page 8

  10. Page 9

  11. Page 10

  12. Page 11

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  15. Page 14

  16. Page 15

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