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STEP for Multi-Disciplinary Model Management: “Intelligent PDM” PowerPoint PPT Presentation

STEP for Multi-Disciplinary Model Management: “Intelligent PDM” Stephen C. Waterbury NASA/Goddard Space Flight Center Presentation for the ESA/NASA Video/Teleconference “STEP for Aerospace Applications” July 16, 1999 The Product Master Model

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Step for multi disciplinary model management intelligent pdm l.jpg

STEPfor Multi-DisciplinaryModel Management:“Intelligent PDM”

Stephen C. Waterbury

NASA/Goddard Space Flight Center

Presentation for the

ESA/NASA Video/Teleconference

“STEP for Aerospace Applications”

July 16, 1999


The product master model l.jpg

The Product Master Model

  • The Product Master Model is a integrated global model of the totality of information contained in all engineering discipline view-models of the product:

    • Mechanical design (MCAD)

    • Electronic design (ECAD)

    • Analysis (CAE) -- all types

    • Systems (requirements, behavior, function, rules)

    • Simulation

    • Visualization

  • STEP Application Protocols provide the basis for a Product Master Model


Without pdm cax models are islands models are isolated within disciplines l.jpg

Without PDM, CAx Models are “Islands”Models Are Isolated Within Disciplines

Mechanical(MCAD)

Analysis(CAE)

Electronic(ECAD)

SystemsEngineering

Tools

Discipline-

Specific

Model

Databases

Item XMCAD

Item XCAE

Item XECAD

Item XSE

Item YMCAD

Item YCAE

Item YECAD

Item YSE


Current product data management pdm models can be associated but not integrated l.jpg

Item Y

Models

Item X

Models

Item YMCAD

Item XMCAD

Item XSE

Item YSE

Item YCAE

Item XCAE

Item YECAD

Item XECAD

Current Product Data Management (PDM):Models Can Be Associated But Not Integrated

Mechanical(MCAD)

Analysis(CAE)

Electronic(ECAD)

SystemsEngineering

Tools

PDM

System


Intelligent pdm ipdm master models integrate discipline models l.jpg

“Intelligent PDM” (IPDM):Master Models Integrate Discipline Models

Mechanical(MCAD)

Analysis(CAE)

Electronic(ECAD)

SystemsEngineering

Tools

Models (Discipline Views)

AP 203

AP 209

AP 210

AP 233

STEP AP's

NASA

Discipline

View Mappings

STEP

Testbed

Integrated

Master Models

Instrument Y

Master Model

Spacecraft X

Master Model


Plug and play ipdm corba pdm enablers object interfaces l.jpg

Plug-and-Play IPDM:CORBA PDM Enablers Object Interfaces

Mechanical(MCAD)

Analysis(CAE)

Electronic(ECAD)

SystemsEngineering

CORBA-

EnabledTool

IIOP

AP 203

AP 209

AP 210

AP 233

Instrument Y

Object

Discipline

Model Mappings

Integrated

Master Models

Spacecraft X

Master Model

Instrument Y

Master Model

NASA

STEP

Testbed


The product master model progressive population of model over the mission life cycle l.jpg

Pre-Phase A

Phase A/B

Phase C/D

IntegratedMission Proposal

Prototypingand Analysis

Detailed Design,Build, and Test

Mission Parameters

Mission Parameters

Mission Parameters

Requirements

Requirements

Requirements

Functional Model

Functional Design

Functional Design

Behavioral Design

Behavioral Model

Interface Control Docs

Preliminary Components

Physical Model

Physical Design/Arch.

The Product Master Model: Progressive Population of Model Over the Mission Life Cycle


Product master model enabled capabilities l.jpg

Product Master Model-Enabled Capabilities

  • “Intelligent Product Data Management”

    Features:

    • Integration of heterogeneous, multi-disciplinary models into a progressively and continuously defined Master Model

    • Algorithmic generation of discipline-specific view-models (where possible) on demand

    • Interdisciplinary tool “object services” (e.g., live linkage of design features between CAD and analysis models)

    • Integration & persistence of global product model knowledge

  • Integrated Model-based Systems Engineering

    Features:

    • Master Model explicitly identifies and maintains discipline model interdependencies

    • Can provide immediate feedback on change impacts

    • Supports cross-disciplinary view of requirements, function allocation, and behavior


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Initial IPDM Capabilities:NASA STEP Testbed FY99 Plans

  • Initial PDM Enablers (PDME) interfaces (CORBA/IIOP access)

  • Check-in/out via PDME (or via file upload thru Web browser) of STEP models/files

  • User-specified project/system/subsystem hierarchy

  • Standardization of a NASA Systems Engineering Information Model

    • Harmonization of Mission Design Parameters among NASA’s Integrated Design Centers

    • Mapping of harmonized parameters to STEP AP 233 (Systems Engineering)

  • Prototyping of MCAD/ECAD/CAE model integration and sharing

    • The NASA STEP Testbed is collaborating with Boeing, IBM, and Delco-Delphi in the PDES, Inc. Electromechanical Pilot*

      * The PDES, Inc. Electromechanical Pilot Project is implementing MCAD/ECAD model exchange using STEP AP 203 and AP 210.


For more info step omg url s l.jpg

For More Info: STEP/OMG URL’s!

  • STEP On-Line Information Service (SOLIS) -- http://www.nist.gov/sc4

  • Expresso for 95/NT (freedownload) -- http://www.nist.gov/expresso

    • Note: if interested in the server (Unix) version of Expresso, contact Steve Waterbury

  • STEP On A Page (a capsule summary and current status of STEP) -- http://pdesinc.aticorp.org/step_on_a_page.ppt

  • PDES, Inc.: a government-industry consortium implementing STEP --http://pdesinc.scra.org

  • USPRO (U.S. Product Data Association), distributor for STEP documents --http://www.uspro.org

  • NASA STEP Central: the main NASA site for STEP information --http://misspiggy.gsfc.nasa.gov/step

  • The NASA STEP Testbed: STEP/OMG infrastructure pilot project --http://misspiggy.gsfc.nasa.gov/step/step.html

  • The OMG Manufacturing Domain Task Force (MfgDTF): PDM Enablers, etc. --http://www.omg.org/homepages/mfg


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    AP 203: Configuration Controlled 3D Designs of Mechanical Parts and Assemblies

    • Configuration Management

    • Authorization

    • Control(Version/Revision)

    • Effectivity

    • Release Status

    • Security Classification

    • Supplier

    • Geometric Shapes

    • Advanced BREP Solids

    • Faceted BREP Solids

    • Manifold Surfaces with Topology

    • Wireframe with Topology

    • Surfaces and Wireframe without

    • Topology

    • Specifications

    • Surface Finish

    • Material

    • Design

    • Process

    • CAD Filename

    • Product Structure

    • Assemblies

    • Bill of Materials

    • Part

    • Substitute Part

    • Alternate Part


    Ap 209 composite metallic analysis related design l.jpg

    • Information Shared Between Analysis & Design

    • 3D Shape Representations

    • Composite Constituents

    • Material Specifications & Properties

    • Part Definitions

    • Analysis Discipline Product Definitions

    • Finite Element Analysis

      • Model (Nodes, Elements, Properties,...)

      • Controls (Loads, Boundary Constraints,...)

      • Results (Displacements, Stresses,...)

    • Analysis Report

    • Composite Constituents

    • Ply Boundaries, Surfaces

    • Laminate Stacking Tables

    • Reinforcement Orientation

    • Design Discipline Product Definition

    • Shape Representations

    • Assemblies

    • Configuration Control, Approvals

    • Part, product definitions

    • Finite element analysis model, controls, and results

    • Material Specifications & Properties

    • Composites

    • Homogeneous (metallics)

    • 3D Shape Representation

    • AP202/203 Commonality Plus Composite Specific 3D Shapes

      • Advanced B-Representation

      • Facetted B-Representation

      • Manifold Surfaces With Topology

      • Wireframe & Surface without Topology

      • Wireframe Geometry with Topology

      • Composite Constituent Shape Representation

    AP 209: Composite & Metallic Analysis & Related Design


    Ap 210 electronic assembly interconnect and packaging design l.jpg

    Part

    • Functionality

    • Termination

    • Shape 2D, 3D

    • Single Level Decomposition

    • Material Product

    • Characteristics

    Configuration Mgmt

    • Identification

    • Authority

    • Effectivity

    • Control

    • Requirement Traceability

    • Analytical Model

    • Document References

    AP 210: Electronic Assembly, Interconnect, and Packaging Design

    Product Structure/Connectivity

    • Functional

    • Packaged

    Physical

    • Component Placement

    • Bare Board Geometry

    • Layout items

    • Layers non-planar,

    • conductive & non-conductive

    • Material product

    Geometry

    • Geometrically Bounded

    • 2-D Shape

    • Wireframe with Topology

    • Advanced BREP Solids

    • Constructive Solid Geometry

    Requirements

    • Design

    • Allocation

    • Constraints

    • Interface

    Technology

    • Fabrication Design Rules

    • Product Design Rules


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