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The Cryogenic AntiCoincidence detector for ATHENA X-IFU: the project status.

18 th International Workshop on Low Temperature Detectors 22-26 July 2019 - Milano, Italia. The Cryogenic AntiCoincidence detector for ATHENA X-IFU: the project status.

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The Cryogenic AntiCoincidence detector for ATHENA X-IFU: the project status.

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  1. 18th International Workshop onLow Temperature Detectors 22-26 July 2019 - Milano, Italia The Cryogenic AntiCoincidence detector for ATHENA X-IFU: the project status. C. Macculia, A. Argana , D. Brienzaa ,M. D’Andreaa, S. Lottia, G. Minervinia, L. Piroa , M. Biasottib, L. Ferrari Barussob, F. Gattib, M. Riganob, G. Torriolic, M. Fiorinid, S. Molendid, M. Uslenghid, E. Cavazzutie, A. Volpee aINAF/IAPS Roma, b Università di Genova Physics dpt., c CNR/IFN, d INAF/IASF Milano, e ASI.

  2. Outline • NXB assessment at the X-IFU FPA and its impact on the CryoAC design • The CryoAC Requirements and Specifications • The CryoAC electronics • The Demonstration Model of the CryoAC • Biasotti M. et al., (poster Id. 101-401, design and production) • D’Andrea M. et al., (poster Id. 66-172, test) • Programmatic aspects: some info about the next activities • …then the conclusions! For info: https://www.the-athena-x-ray-observatory.eu/ http://x-ifu.irap.omp.eu/ X-IFU movie: https://www.youtube.com/watch?v=mOf6WIDmi30

  3. The Athena Observatory: 1 telescopefor 2 instruments! The Hot Universe: How does ordinary matter assemble into the large-scale structures we see today? The Energetic Universe: How do black holes work and shape the Universe at all scales? • Ariane VI class launcher • Satellite mass ~ 7000 kgPower ~7000 W • Focal length: 12 mLifetime: 4years (10 yearsparts) • Silicon Pore Optics: • Effective area: 1.4m2@1 keVPSF (HEW): 5’’ • X-ray Integral Field Unit: • E: 2.5 eVField of view: 5 arcmin • Detectors cooled at 50 mK • Wide Field Imager: • E: <80(<170)eV@1(7keV)Field of view: 40’ x 40’ CREDITS: ESA, JAXA, NASA, WFI and X-IFU consortia, fundingagencies

  4. X-IFU Non-X-ray-Background assessment: Geant4 simulation Sources of particles: Soft protons/ions (E < few hundred’s keV, origin from the Sun and L2 magnetotail) collimated by the opticstowards the FPA producing also secondaries+GCRs (hundred’s MeV to GeV) that crossing the satellites over 4sr arrive at the FPA producing also secondaries. Only GCRs have enough energy to cross the cryostat and FPA to hit the TES arraythus decreasing the instrument sensitivity. Solution: CryoAC + bi-layer electron liner. protons photons The Non-X ray-Background requirementis5E-3 cts/cm^2/s/keV (2-10 keV TBC). neutrons (CAD: credits CNES/SRON) electrons Without any kind of reduction technique the X-IFU would experience a GCR-protons induced background level 37 times above the 5 × 10-3 cts/cm2/s/keV requirement AREMBES + EXACDRAD (ESA contract, ATHENA «X-IFU + WFI») activity for L2 environment + Geant4 REQ.

  5. CryoAC Design concept (1/2) Athermals are used as “flag” to rise the particle veto: the more you are able to collect all athermal phonons produced, the more the pulse will be well formed and the energy response well shaped (poster Id. 101-401 M. Biasotti for Physics and design). Ballistic athermal phonons (sound-like) can soon enter the TESes deposited on the crystal surface, quickly heating their electron gas thus forming a first pulse. Then, the diffusive phonons (heat) will rise generating an added thermal pulse. • 4 bridged-suspended Si absorbers to have a well controlled G • About 120 Ir/Au TES uniformly distributed on each absorber surface to well collect athermal phonons • Distance from TES array < 1 mm • Pt Heaters deposited onto the absorber to increase its temperature if necessary • Expected high critical current (AC-S8 ~ 8 mA at 0 K)  to decrease bias currents to limit magnetic coupling effects to the TES array (to be traded-off vs Rshunt) • Detector diagnostics

  6. CryoAC Design concept (2/2): the electronics • FourTESespixels, each one readoutby a dedicated SQUID • no multiplexing • Standard FLL readout • Veto operation will be performed on ground, given the expected modest telemetry rate.

  7. Given the above CryoAC requirements and specifications, the present design assumes that the CryoAC detector assembly is built as 4 identical trapezoidal pixels, each one connected to the silicon rim by 4 bridges per pixel in order to realize the thermal conductance to the thermal bath, but there is on-going a study to trade-off this baseline wrt a monolithic geometry to see pro and cons in terms of detector responsivity, rejection efficiency, deadtime, robustness. Baseline: segmented Trade-off: monolithic, same TES footprint Goal: TES interdigitation

  8. DM CryoAC Fabrication process (M. Biasottiposter Id. 101-401) Silicon wafer Ir:Au bilayer deposition by PLD TES by Ir/Au bilayer etching Pt heaters fabrication Au thermalization layer deposition on rim 1 4 • Niobium wiring (lower strip) fabrication • Silicon oxide insulation • Niobium wiring (upper strip) fabrication • Deep RIE: • Al Hard-mask deposition • Etching using bosch process • Removal aluminum mask 2 3 [A] 5[B] 7[D] 6[C] 9 8[E] At presentwe are qualifying this list of processes to increase the detector production yield Si beams: 100x1000x525 um^3

  9. The CyroAC DM: AC-S10 (Poster Id. 66-172 M. D’Andrea)(aim: functionalqualification to get TRL5. Stand alone detector compliant with the REQs.atpresentat SRON for the integratedchipset test) • Bridged-suspended Si absorber (500 um thick, 1 cm2 area) • Thermal conductance towards the external rim defined by 4 silicon bridges (1000x100 um^2, height 525 um). • 96 Ir/Au TES uniformly distributed on absorber surface • Anti-inductive overlapping Nb wiring • Gold plated Si rim (16.6x16.6 mm^2, 2.3 mm width) • 4 Pt Heaters (in parallel) embedded on the absorber to be probed during combined DM test • Pixel size (abs. area): •  10x10 mm2 • Energy threshold: 2.75 keV • DM Threshold at 20 keV • Bath Temperature: • 50-55 mK • Power dissipation: ~ 2.5 nW • DM < 40 nW • ΔE (6keV) = 1.3 keV (FWHM) Consistent with our Design Concept due to compliance with what requested in XIFU-CRYOAC-R-0015 (detection efficiency EW-th = 6 keV TBC).

  10. AC-S10: Test results (Operation at Tb= 50 mK) 55Fe + 35 keV (heater) Thermal conductance and R-T Saturationby heatpulses (heater on-board)  Deadtime LEFT: DM CryoAC inside the 40 pxlB setup at SRON for fitchecking (creditsSRON) BOTTOM: DM Electronics integration in SRON Consistent with the phononicDebyeterm in dielectrics (Si) Main array CryoAC

  11. Nearterm CryoAC activities: MAR (TRL5) end 2021 • Trade off study (Q2 2018 – Q4 2019) • Heater vs R_shunt • Twoprototypes (Heater vs R_shunt and athermal cross talk) • Monolithic/Segmented • ESA CTP activities on microcalorimeters (Q2 2019 – Q2 2020) • SM1: standaloneassembly (CryoAC + bracketnothavingfullyrepresentative i/f wrt the FPA) • twodummies: segmented/monolithic to be vibrated (feedback on Si-beamsaspect ratio  «G» thermal conductance) • Proto-EM (design & MAIT)  Hexagonal geometry havingonly 1 instrumentedreadoutchain • SM2 (Q4 2019 – Q4 2020) • Structural model (maybe EM-like) to reach the TRL5 as requested by ESA. Assembly(CryoAC + bracket) having representative i/f wrt the FPA • Warm Electronics BreadBoard (WE BB) activities (Q3 2019 – Q4 2020) • WE BB manufacturing • Proto-EM/WE BB AIT • E2E simulator (Q2 2018 – Q4 2021) • detector (athermals + thermals pulse production) and WE simulators (trigger logic)

  12. Conclusions • Bkg activities: slight revision of the mass model  new simulations to be run • DM CryoAC (96 TES in parallel connected deposited onto thin -525 um- Si suspended absorber) tested at stand alone level: • On-board heater quite interesting function • very low energy threshold (< 3 keV) and spectroscopic capability (~ 20%@6keV) • provided to SRON for the integrated chipset test with the TES array • By the end of the year closure of the hexagonal design (monolithic vs segmented to be vibrated by November 2019) • SM2 for environmental (vibration) qualification representative of the FPA i/f to get TRL5 expected by mid 2020 • CryoAC E2E simulator by Q4 2021 • Athena MAR (Mission Adoption Review): end 2021 • Athena launch: 2031

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