Cutting edge technology in optical inspection of BGA, µBGA, CSP and FlipChip soldering!. Product Review:. Optilia BGA Inspection Systems. RevB, November-2013. Optical BGA Inspection vs. X-ray. Capabilities. What are the Applications?.
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Cutting edge technology in optical inspection of BGA, µBGA, CSP and FlipChip soldering!
Optilia BGA Inspection Systems
Swedish patent: SE 528,286
US patent: US 7,643,136
Front-Light intensity control
Back-Light intensity control
Light cone from
flexible fiber bundle
Light cone from
Twin light cones from Micro prisms
BGA solder ball illuminated by front incident light only. Surface structure and shape are visible.
Same ball with both front- and back-illumination, normal intensity. Surface structure, shape and solder wetting are visible.
BGA lens is Refocused. Bridges, contamination, fibers, excess flux are visible now.
Front light intensity is increased! Surface structure of second row bumps become visible!
Normal intensity front-light (incident) only.
Normal intensity front and back-light.
Extra intensity front- and normal back-light.
Refocused on second rows of bumps.
Normal intensity front- and back-light.
Refocused on thirds rows of bumps.
Connection failure, BGA component.
Crack on lead solders, JLCC component.
Fibres between BGA balls
Optilia BGA inspection technology
Same component. Lens is re-focused!
Built-in LED Light
Polarized LED Light
50x magnification, built-in RingLight
10x magnification, built-in RingLight
500x magnified solder past
250X, SOIC leads
Stainless steel housing
Prisms for front Illumination
Prism for Image
Larger Angle of View of the system makes hidden rows more visible!
AoV > 90o
Red cone: Angle of View of the BGA lens with 2.0Mp camera
Black cone: Angle of View of the BGA lens with 5.0Mp camera
Designed for imaging BGA components with low stand-off
µBGA with 120 mm stand-offSmall size lens with 2.0 MP camera
µBGA with 120 mm stand-offSmall size lens with 5.0 MP camera
Adjustable Focus for imaging up to 20 Rows for BGA
Flexible and Configurable
OptiPix, Image Capture, Analysis, Measurements and Archiving.
Overlays and Annotation
Image file structure and Database