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GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7

Gamma-ray Large Area Space Telescope. GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7 Sept 27 Monthly Review Gunther Haller haller@slac.stanford.edu (650) 926-4257. TEM/TPS Status. Status Qual unit review still to occur

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GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7

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  1. Gamma-ray Large Area Space Telescope GLAST Large Area Telescope: Electronics, Data Acquisition & Flight Software W.B.S 4.1.7 Sept 27 Monthly Review Gunther Haller haller@slac.stanford.edu (650) 926-4257

  2. TEM/TPS Status • Status • Qual unit review still to occur • 19 flight units delivered to I&T • 2 TPS units removed from Twr A and Twr B were partially modified • To do (low priority) • Complete modification • Vibration • End data package review

  3. PDU Status and Schedule • 1st unit (flight) • In hands of I&T • 2nd unit (spare) • Progress since last month • Boards conformal coated • Includes • Coating • AF QC, touchup, QC • SLAC (customer) source-inspection, touch-up, CSI • Integration into enclosure • Started wiring • Lower priority compared to assembly of SIU modules, but progressing, estimated delivery to I&T end of December

  4. GASU Status and Schedule • First Unit • Progress since last month • Received final box • Passed Safe-to-mate (without power) • Passed Stray-voltage tests (with power) • Passed Comprehensive Performance Tests • Thermal-cycled • Passed post TC tests • Vibrated to proto-flight levels • Passed post-vib tests • Started thermal-vacuum test, expected completion Nov 7 • EMI left, if proto-flight EMI: 2 weeks, if flight acceptance: 1 day • GASU available Nov 9 or Nov 23, depending on EMI decision • Schedule for 2nd unit • Progress since last month • QC&CSI, rework and again QC&CSI of DAQ and power-supply boards (pre-coat) • Boards are being installed in enclosure with harness • In about 3 weeks the box will be sent to SLAC for pre-coat testing, followed by conformal coat and environmental testing • Lower priority compared to SIU/HCB but still progressing • (Mid January estimated delivery to I&T)

  5. SIU Protoflight • Protoflight SIU crate • Progress since last month • Received backplane assembly (backplane 2412) • Integrated in enclosure • Passed short/open test • Integrated SIB2205, LCB2225 CPS2233, RAD750-CPU • All from flight assembly line, SIB has chlorine-contaminated EEPROM • Passed environmental testing • Passed Comprehensive Performance testing • Thermal-cycled • Passed testing • Vibrated to proto-flight levels • Passed testing • Thermal-Vacuum tested (proto-flight limits) • Full EMI tested (passed qualification tests, conductive/radiative) • Mass and CG measured

  6. First Flight Crate • Progress since last month • Modules • Backplane 2414/2428 • integrated in crate 2513 • SIB 2207 • shipped to SLAC and module tested • LCB 2227 • shipped to SLAC and module tested • CPS 2235 • shipped to SLAC and module tested • RAD750 14/2516 • Crate integrated, tested • Thermal-cycle, tested • Vibrated, tested • Thermal vacuum tested • EMI, tested • Mass measured • No failure • Working on web-site to list test results, closing of NCR’s

  7. Second Flight Crate • Progress since last month • Modules • Backplane 2415/2429 • harness assembly completed, coated/QC/CSI/touch-up/delivered to SLAC, open/short tested • Integrated in crate 2527 • SIB 2208 • shipped to SLAC and module tested • LCB 2226 • coated, shipped to SLAC, tested • CPS 2238 • shipped to SLAC and module tested • RAD750 15/2517 • Crate tested • Thermal-cycle, tested • Vibrated, tested • Thermal vacuum tested • EMI, tested • Mass measured • No failure • Working on web-site to list test results, closing of NCR’s Coated really stands for: take hardware off (rails, etc), coat, QC, touch-up, CSI, touch-up, QC/CSI, add hardware, bond, QC/CSI, stake, QC/CSI

  8. Third Flight Crate • Progress since last month • Modules • Backplane 2420/2433 • harness assembled, coated, shipped to SLAC, open/short tested • Integrated in crate 2522 • SIB 2206 • xrayed, shipped to Silver, tested, shipped to SLAC, tested, shipped to AF, coated, shipped to SLAC, tested • LCB 2228 • coated, shipped to SLAC, tested • CPS 2239 • coated, shipped to SLAC, tested • RAD750 17/2518 • Crate integrated, tested • Thermal-cycle, tested • Vibrated, tested • Waiting for thermal vacuum testing (GASU is in TV chamber) • EMI, will be tested this week before TV • Mass measured • No failure up to now • Estimated completion of testing: Nov 15 • Working on web-site to list test results, closing of NCR’s Coated really stands for: take hardware off (rails, etc), coat, QC, touch-up, CSI, touch-up, QC/CSI, add hardware, bond, QC/CSI, stake, QC/CSI

  9. Fourth Flight Crate • Progress since last month • Modules • Backplane 2419/2434 • harness assembled, coated, shipped to SLAC, open/short tested • Integrated in crate 2523 • SIB 2209 • flying probe tested, assembled, shipped to SLAC, xrayed, shipped to Silver, tested, shipped to SLAC, tested, shipped to AF, coated, shipped to SLAC, tested • LCB 2229 • flying probe tested, assembled, shipped to SLAC, xrayed,, tested, shipped to AF, coated, shipped to SLAC, tested • CPS 2240 • assembled, shipped to SLAC, tested, shipped to AF, coasted, shipped to SLAC, tested • RAD750 18/2519 • Crate integrated, tested • In Thermal-cycle • To be done • Vibration • Thermal vacuum • EMI • Mass • Estimated completion: Nov 22 Coated really stands for: take hardware off (rails, etc), coat, QC, touch-up, CSI, touch-up, QC/CSI, add hardware, bond, QC/CSI, stake, QC/CSI

  10. Fifth Flight Crate • Progress since last month • Modules • Backplane 2418/2431 • harness assembled, coated, shipped to SLAC, QA issues, shipped back to AF, in rework, will be shipped to SLAC early next week • Will be in crate 2523 • SIB 2210 • assembled new EEPROM, flying probe tested, assembled, shipped to SLAC, xrayed, shipped to Silver, tested, shipped to SLAC, tested, shipped to AF, in coating • LCB 2230 • flying probe tested, assembled, shipped to SLAC, xrayed,, tested, shipped to AF, coated, in QA/CSI, will be shipped to SLAC tomorrow • CPS 2234 • Assembled, shipped to SLAC, tested. Shipped to AF, in coating • RAD750 13/2528 • Crate to be integrated • To be done • TC • Vibration • Thermal vacuum • EMI • Mass • Estimated completion: Dec 6 Coated really stands for: take hardware off (rails, etc), coat, QC, touch-up, CSI, touch-up, QC/CSI, add hardware, bond, QC/CSI, stake, QC/CSI

  11. Spare crates • Modules • 2 Backplanes • Ready for integration Nov 30, Dec 7 • 2 SIB’s • Ready for integration Nov 19, Nov 28 • 2 LCB’s • Ready for integration Nov 19, Nov 28 • 2 LCB’s • Ready for integration Nov 23, Nov 23 • Estimates for Spare Crate availability • Dec 16 & Dec 23

  12. Harness Interconnect Box (HIB) • Task: Integrate, stake, pre-tested harness into (SIU) enclosure • Progress since last month • Assembled 5 HIB’s at SLAC • Two vibrated • 3 more about to be vibrated • Ready for hand-off to I&T early next week

  13. Heater Control Box (HCB) • 6 Boards for 3 boxes assembled (2 flight + 1 spare) • 4 Boards for 2 boxes conformal coated • 2 boards integrated into one box with harness • In QA at AF • 2nd box will be in QA early next week • Then TC/TV/vib/EMI at SLAC • Estimated delivery of 2 HCB’s to I&T: Nov 24

  14. cCPI Connector Solder Joint Slide • SLAC Qual testing of sample boards assembled at Aeroflex • Non-flight, only connectors were assembled on cCPI board for short/open testing of solder joints • Testing was all completed without failures • Presentation at • http://www-glast.slac.stanford.edu/Elec_DAQ/DAQ-Hardware/SIU-EPU/xray/xray-qual.htm • Overall cCPI solder joint results on flight boards • 5 flight backplanes accepted to use-as-is, see following 5 slides for detailed results • Process is • SLAC looked at xrays, had touched up candidates • Then GSFC supplied a list fo pins to be touched up • SLAC went thru and identified pins which are used • Those were discussed and some were touched up • Plug-in cards • Same process as with backplanes • Maybe 1 or 2 pins on some boards which GSFC likes to have touched-up • Discussed and agreed on boards already integrated • SLAC is touching up all boards not integrated yet and supply new xrays (in progress)

  15. First Flight Backplane 2414 • 22 pins identified on GSFC list out of 2,000 pins • Not used (16 pins) • Already identified on SLAC list • X1: P5-D11; P5-C12; P5-D12; • X2: P1-B17 • X3: P1-B17 • Not used from remaining identified (X1-P5, X2-P1 not used as stated) • X1: P5-E11 • X2: P1-A19 • X2: P2-C10, B11, C11, D11; P4-C6 • X3: P1-B2 ; P1-B6 (red+5); P5-B2 (ch-gnd); P5-C14 (red+5), P4-B21 (redGND); • X4: P5-B5 (red+3.3) • Used • Already identified on SLAC list • X1: P1-B15 (Frame#); • X3: P1-A7 (AD30); • Not on SLAC list • X1: P1-C23 (AD3) ; • X3: P1-D16 (stop_n) • Conclusion • GSFC accepted X1-P1.C23 and X3-P1.D16 as is but wanted to improve X1-P1.B15 and X3-P1.A7 • Those 2 pins were already touched-up since they were on SLAC’s original “nice-to-improve” list but no xrays were taken after touch-up since pins were already acceptable in SLAC’s view before touch-up • Final decision: use-as-is

  16. Second Flight Backplane 2415 • 18 pins identified on GSFC list out of 2,000 pins • Not used • Already identified on SLAC list (7 pins) • X2: P1-B3; P4-A15; P4-B23; • X3: P1-B8; P2-C12; J4-C1, J4-C16 • Not used from remaining identified • X1: P1-A19 (3.3V, one of 7 pins, not needed) • X3: P2-B12; P3-C1 (red+5), C3 (red+5), E4 • X4: P1-B1 • Used • Already identified on SLAC list • X4: P1-C23(AD3); P4-C11(EI_PRIM_5_N); P4-C21(EI_PRIM_2_P) • Not on SLAC list • X1: P1-B19 (AD15), P1-A20 (AD12) ; • Conclusion • GSFC accepts all except X4-P1.C23 • That one pins was already touched-up since it was on SLAC’s original “nice-to-improve” list but no xrays were taken after touch-up since pins were already acceptable in SLAC’s view before touch-up • Final decision: use-as-is

  17. Third Flight Backplane 2420 • 5 pins identified on GSFC list out of 2,000 pins • Not used • Already identified on SLAC list • None • Not used from remaining identified • X1: P2-C21 • X2: P1-D25 • X3: P2-E8, B13 • X4: P5-C22 • Used • None • Conclusion • Final decision: use-as-is

  18. Fourth Flight Backplane 2418 • 17 pins identified on GSFC list out of 2,000 pins • Not used • Already identified on SLAC list • None • Not used from remaining identified • X1: P2-B5, P4-E7, D8, E8, D9 (P4 not used) • X2: P1-D11, B23, B24, C24; P2-B1, C1; (P1, P2 not used) • X2: P4-C9 (red+5); P5-A5 (red-28) • X4: P5-D21 • Used • Already identified on SLAC list • None • Not on SLAC list • X1: P2-B6 (GBM RDNT) • X3: P1-E7 (AD27) • Result • SLAC agreed to touch-up those 2 pins and also rexrayed the board • Conclusion • GSFC agrees that pins were improved • Final decision: use-as-is

  19. Fifth Flight Backplane 2419 • 6 pins identified on GSFC list out of 2,000 pins • Not used • Already identified on SLAC list • X1: J5-C13, B15 • Not used from remaining identified • X1: P5-C15, A18 (X1-P5 not used) • X3: P2-D10 • X4: P2-A10 • Used • None • Conclusion • Final decision: use-as-is

  20. Level 3 Milestone Count

  21. Level 3 Milestone List

  22. Level 3 Milestone List

  23. Level 3 Milestone List

  24. Cost Report

  25. FTE Report (DOE/NASA-funded only)

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