A Combined Pressure and Temperature Sensor
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A Combined Pressure and Temperature Sensor without external temperature probe Content (1) Key P/T Sensor Specifications (2) Patented Thin Film Technology (3) Sensor Design for CO2 / R744 MACS (4) Finite Element Modeling / Simulation (5) Qualification Testing

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A Combined Pressure and Temperature Sensor without external temperature probe

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Slide1 l.jpg

A Combined Pressure and Temperature Sensorwithout external temperature probe


Content l.jpg

Content

(1) Key P/T Sensor Specifications

(2) Patented Thin Film Technology

(3) Sensor Design for CO2 / R744 MACS

(4) Finite Element Modeling / Simulation

(5) Qualification Testing

(6) Other Thin Film Applications and Sensor products


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(1) Key P/T Sensor Specifications

  • Pressure:Measurement Range0 to 170 BarAccuracy< ± 1,0%(F.Sp.)Response time~4 ms(t63)

  • Temperature:Media -40°C to +180°CAccuracy ~ ± 3 KResponse time< 10 sec(t63)Ambient Temperatureup to 135°C

  • Electrical Interface:3-pin LIN2.0,3-pin PWM,4-pin P/T analog


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(2) Patented Thin Film Technology

  • Thin Film Element on SST

  • Sputtered Metal Strain Gauge

  • TiON Strain Gauge with high K-Factor/ Gauge Factor: K: TiON ~ 5 (CrNi ~ 1,1..2)K-Factor: dR/R= K * dl/l

  • High Temperature Resistance (330°C)

  • Pressure Range: 10 to 3.000 Bar

6 mm


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(3) Sensor Design for CO2 / R744 MACS

  • Digital output: LIN2.0 or PWM(Temperature output embedded in signal)

  • Integrated Temp. feature: Less part complexity, higher reliability, less flow restriction and reduced leakage risk.

  • Long term stability, Rugged Design.

  • Smallest possible thread interface: M10x1mm


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Connector

Flexwire

Component board

with µC

Housing

Flexwire

DV Chip

Combined Sensor Assembly (p,T)

p,T

Exploded View / Cross Sectional


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Kavlico DV Chip

Dual Frequency-Output ASIC for Thin-Film and PRT Resistive type sensors:

  • Ratiometric multiplexed frequency (digital) output for Sensor (Pressure-) and Temperature-data.

  • Coarse gain and offset calibration via serial-interface, allowing wide range of sensors.

  • Fine calibration by µP ; calibration coefficients to be stored in memory of µP.

  • Extreme temperature range ( -50ºC to +200ºC ).

  • Low-Power (sleep mode and 3mA operational current)

  • Self-diagnostics and failure analysis.


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Bumps on DV Chip

Electrical Contact

Underfill Adhesive

Bridge pads

DV Chip placement on Thin Film Flexure

  • Accurate Temperature measurement independent from ambient temperature.

  • Digital, non-susceptible output (temperature output embeded in signal).


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Schematic

Conditioning(PC Board)

Sensing(Sensor assy)

p

T

Micro Controller

Flexwire

Inter-connection

DV chip

Thin Film

Strain

Gauge

LIN2.0

Transceiver

Out


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(4) Finite Element Modeling of P/T Sensor


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The influence of DV chip on the stress distribution and deflection of diaphragm is small

r

R

Condition: 180ºC temperature, 150 bar pressure

Effect of Chip on Diaphragm Stress and Deflection


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  • Ambient Conditions:

  • 25ºCstill air

  • 150ºCstill air150ºC air flow / 4.4 m/s

  • 135ºC still air

Thermal AnalysisImpact to electrical Components (PCB)

CO2 @ 200 kg/h and 180ºC or 165ºC


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Temperature Distributions after 5 Min. (25ºC Ambient Temperature)

25°C, Voo = 0m/s

Printed Circuit Board

112~140ºC

Initial Fluid Temperature: 25ºC; Transient to 180ºC


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b) Temperature Distributions after 5 Min. (150ºC Ambient Temperature)

150°C, Voo = 4.4m/s

150°C, Voo = 0m/s

166~172ºC

167~173ºC

Printed Circuit Board

Initial Fluid Temperature: 25ºC; Transient to 180ºC


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Replace PCB

ULTEM 2310 PolyetherimidePlastic Connector

Circuit Board

Stainless Steel 304L

Mount the circuit board to components with low thermal conductivity (plastics) away from the metal housing.


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c) Design at 135ºC Ambient Temperature

CO2 Temperature

Printed Circuit Board Temperature

141-144ºC

5 min of 180ºC

5 min of 165ºC

139-141ºC

Initial Fluid Temperature: 135ºC; Transient to 180ºCand165ºC


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Conclusions

  • DV chip has negligible influence on the performance of sensor diaphragm / pressure sensor functionality.

  • By connecting the circuit board to plastics and away from the metal housing, the circuit board temperature can be reduced to around

    ~ 140ºC under 135ºC ambient Temperature


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(5) Qualification Testing

  • Leackage test Requirement <1,0 gram per year The test is carried out at an external test lab, specialized on these kind of tests.

  • Design validation test on sensor levelStart after sample build in July 2008Duration appr. 6 month.


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(6) Other Thin Film Application and Sensor Products:

  • Direct Fuel Injection / Common Rail

  • In-Cylinder Pressure

  • Transmission / Break Pressure

  • Compressed Natural Gas (CNG)

  • Traction Control

  • (Mobile) Hydraulic Pressure / Controls

  • HVAC / Hydraulic Machinery


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Contact:Mr. Markus ButenopDirector of SalesKAVLICO GmbH Potsdamer Str. 1432423 Minden GermanyPhone:+49 (0)571 3859 – 171Fax.:+49 (0)571 3859 – 119Email:mbutenop@kavlico.deWeb:www.kavlico.de / www.cst-sensors.com


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