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XFP System and 10G Common Electrical Interface. Dong Zheng BitBlitz Communications Milpitas, California [email protected] . Agenda. XFP modules vs. others Host systems architectures Implementation examples. Box-to-Box: Optical Modules. 300 pin MSA Large on Board Footprint Cost: 20x

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Xfp system and 10g common electrical interface l.jpg

XFP System and 10G Common Electrical Interface

Dong ZhengBitBlitz Communications

Milpitas, California

[email protected]


Agenda l.jpg
Agenda

  • XFP modules vs. others

  • Host systems architectures

  • Implementation examples


Slide3 l.jpg

Box-to-Box: Optical Modules

300 pin MSA

Large on Board Footprint

Cost: 20x

x16 Mux I/F

Xenpak

Plug-able

Cost: 4-6x

XAUI I/F

Xpak/X2

Plug-able

Cost: 2x

XAUI I/F

REQUIREMENTS!

Lower Cost

Smaller Form Factor

(Greater Line Card density)

Lower Power

XFP/SFP

Plug-able

Cost: 1x

10G Ser I/F


Xfp vs other modules l.jpg
XFP vs. other modules

Notes: * The XFI electrical spec is part of the XFP spec, but is expected to be used elsewhere.

Notes: * The XFI electrical spec is part of the XFP spec, but is expected to be used elsewhere.


10ge applications l.jpg
10GE Applications

Host

Module

XGMII

XAUI

ASIC

3G

SerDes

80

16

XENPAK,

XPAK, X2

XFI

ASIC

XGMII

10G

SerDes

3G

SerDes

XAUI

4

80

16

XFP

Optical

XFP philosophy: Minimal electrical circuits in module


10ge electrical interfaces l.jpg
10GE Electrical Interfaces

XFP host design guide line:

XFI 10G interface keeps short

XAUI extends reach distance


10g cei sr xfi l.jpg
10G CEI SR (XFI)

  • Rate from 9.95Gbps to 11.09Gbps for SONET, 10GE, 10GFC applications

  • Max recommend host PCB length <200mm, depending on geometry and material

Near-end eye mask

Far-end eye mask


Design example l.jpg
Design Example

Devices used:

10G SerDes: BBTX100

3G SerDes: BBT3420

Standard FR-4


Test results l.jpg
Test Results

Note:

Far-end eye

Near-end mask

Potential driving

optics directly


Summaries l.jpg
Summaries

  • XFP modules are lower power, smaller form factor, lower cost for higher line card density over competing solutions

  • 10G electrical interface is more challenging compared to XENPAK based modules

  • Reference system has demonstrated feasibility of the XFP host system, with significant margin on 10G electrical interface.


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