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MIO-5270 Sales kit MI/O Extension SBC (AMD G-Series)

MIO-5270 Sales kit MI/O Extension SBC (AMD G-Series). E mbedded  S tackable  B oard C omputer PM S andy Chen sandy.chen@advantech.com.tw Nov’. 20 .2011. MIO-5270 Compelling Features. AMD G-Series MI/O Extension SBC with 48-bit LVDS/ HDMI/ VGA/ DirectX 11

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MIO-5270 Sales kit MI/O Extension SBC (AMD G-Series)

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  1. MIO-5270 Sales kitMI/O Extension SBC (AMD G-Series) Embedded Stackable Board Computer PM Sandy Chen sandy.chen@advantech.com.tw Nov’. 20 .2011

  2. MIO-5270 Compelling Features AMD G-Series MI/O Extension SBC with 48-bit LVDS/ HDMI/ VGA/ DirectX 11 2 GbE/ HD Audio/ 4COM/ 2 SATAII/ 6 USB2.0/ Mini-PCIe/ 1 CFast/ MIOe AMD G-Series + AMD A50M, DDR31066MHz T40R1.0G SC(5.5W) / T40E 1.0G DC(6.4W) (Fan-less) T56N 1.65G DC (18W) +A50M(4.7W) DirectX 11, 2D/ 3D/ Motion Video Acceleration Multiple display: 48-bit LVDS, HDMI, VGA Hardware decode (UVD 3):H.264, VC-1 & MPEG2 Low Power Consumption (kit TDP: 10.5~23W) 12V DC Power input , support DC power hot plug design Extended Temperature Option (-20~80C) 2 GbE/ HD Audio 4 COM/ 6 USB2.0/ 2 SATAII/ GPIO/ SMBUS/ CFast MIOe/ Mini-PCIe Expansion or mSATA DC Jack Advantech iManager & SUSIaccess Supports Embedded Software API and Utility Win CE, Win7 , WinXP, WinXPe, Linux Support 2 x 2 Power 2018/Q3 Longevity Available Now!

  3. MI/O Extension Features

  4. MIO-5270 Product SPEC

  5. Block Diagram

  6. Board Layout – Component Side Inverter SATA Power SATA1 SATA2 Reset Power Button RS422/485 DDR3 SODIMM AMD A50M AMD G-Series eDP LVDS Power Select (3.3V/ 5V/ 12V) USB 5/6 FAN 48 bits LVDS SMBUS DC Power HDMI VGA USB 1/2 USB 3/4 GbE1 GbE2 HD & PWR LED

  7. Board Layout – Solder side RS422/485 Select COM2 (RS422/485) Audio GPIO COM1/3/4 (RS232) MIOe Expansion Mini PCIe CFast socket • Dimension (mm): 146 mm (L)* 102 mm (W)(5.7" x 4.0")

  8. Rear I/O Placement Power Connector Type Option DC Jack MIO-5270D-S6A1E MIO-5270S-S0A1E MIO-5270D-S0A1E If need specific power connector type on different SKU, support by request.

  9. Thermal Solution

  10. MIO-5270 Advanced Technology • AMD G-Series Low Power Consumption Solution • Power Consumption: • T40R 1.0G Single Core: TDP of AMD bundle kit is 10.5 Watts (Value) • T40E 1.0G Dual Core : TDP of AMD bundle kit is 11.4 Watts (Low Power) • T56N 1.65G Dual Core: TDP of AMD bundle kit is 23 Watts (Performance) • Low Idle Power: • Optimized display refresh minimizes DRAM activity, Display refresh doesn’t require chipset activity • UVD 3.0 offloads video decode dramatically reducing CPU loading during video playback • Maximum Integrated Graphics Performance! • AMD graphics core with DirectX® 11 • Support 48-bit LVDS, HDMI V1.3, VGA (eDP option) • 2D/ 3D/ Motion Video acceleration • DVD/ Blu-ray • MIOe Expansion with Maximum Flexibility • Unified pin definition including Display, Communication, I/O, Storage, Power interfaces… • MIO-5270 provides the computing & power, customer can choose standard module or design self module to secure domain knowhow. • Efficient schedule with complete solution (MIO-5270 + MIOe module) • Less RD design resource & total cost • Support iManager • Enhance system reliability. • Manage onboard devices .

  11. Design for Ruggedized Solution--- Advantech MIO-5270 • MIO-5270 is designed with 100% Solid Capacitors (固態電容) • Higher tolerance for high frequencies & high temperature • With better MTBF compared with Electrolytic Capacitors • No more exploding capacitors • More reliable solution if using Solid capacitors than Electrolytic capacitors • High ESD Protection for RS-232 I/O Pins to ±15kV • IEC61000-4-2 Air Gap Discharge: ±15kV • IEC61000-4-2 Contact Discharge : ±8kV • Human Body Model: ±15 kV • Rugged Design on Selected Components • Wide temperature design and test criteria: Power/ Clock generator/ Sequence • PCB Type: TG-150 as PCB type, much reliable in high temperature environments.

  12. Power Hot Plug Design on MIO-5270 • MIO-5270 was designed for single 12V DC in and with Power Hot Plug protection IC design on MIO-5270. The power tolerance range is 12V +/-10%. • Based on following operation process, MIO-5270 still can work stable to bootup if the power tolerance range is 12V +/- 10% • Standard power turn on process on normal single board. • Connect SBC + power cable + power supply or DC power module, then turn on the power button as ON. • Not normal power turn on process: • Turn the power button as ON first, then connect SBC + power cable + power supply or DC power module, in such kind of operation the board may with unstable problem (board damage, not bootup…) with unstable surge. DC Power Module DC Adapter Power Supply 2x2 right angle power connector DC Jack

  13. AMD G-Series Platform- GPU Architecture

  14. AMD G-Series Platform- Direct X11 - DirectX 11 Enables an Amazingly Rich Experience

  15. AMD G-Series Platform- Software Support Linux Support

  16. Performance Benchmark

  17. MIO-5270 Performance_CPU Test with 2GB Memory

  18. MIO-5270 Performance_Graphic

  19. MIO-5270 Power Consumption

  20. Rugged Design on ESBC w/ iManager

  21. Power Consumption

  22. iManager for ESBC--- Guaranteed Boot up at Extreme Cold Bootup Start BIOS Initial System Running OS iManager

  23. iManager for ESBC--- Voltage Dips & Interrupt Detection & Recovery System Hanged Voltage Dips System Running Voltage back to normal range Initial System Running Bootup iManager

  24. Target Applications Fan-less when using heat spreader Digital Signage HMI (Human Machine Interface) General Purpose Less effort to get “Flexibility” Casino Gaming, Pachinko/Slot Machine POS/ KIOSK Feasibility management Medical Transportation

  25. Order Information Packing List Embedded OS/ API Optional Accessories

  26. New Form Factor: MI/O Extension

  27. Why a New Form Factor – MI/O Extension - Takes New Position between SBC and COM • Resource: Need redesign PCB to fulfill the SPEC requirement • Options: Go ODM or SOM projects for customized demand, need higher quantity & NRE. The SPEC on standard SBC can’t be fulfilled if need additional I/O change • Less cabling: less problems and cost on assembling. • Concentrated thermal design: make thermal design be easier in customer’s system integration. The customer needs a board easier for system integration The customer hopes to keep domain knowhow through easier way • Documentation: customer can keep domain knowhow to design their own I/O module by referring to Advantech design guide & SPEC. Time to Market Time to Profit • Save development schedule and cost: Choose one platform based on MI/O Extension structure, just change I/O module can approach different applications in a short time.

  28. Positioning on Different Solutions

  29. MIO/ MIOe Solution from Advantech MI/O Extension: Multiple I/O Extension • 100% Done on MI/O Extension • W/ CPU, memory, power, complete I/O and expansion slots • Better thermal design • Requires less cabling • Flexibility from MIOe • Secure core knowledge on MIOe modules • Advantech provide MIOe design guide for reference • Unified multiple interfaces & ready for future mainstream interfaces • Power comes from MI/O CPU board instead of MIOe, less design effort, • Easy for System Integration • SFF in 146* 102mm on MI/O Extension • Easier system assemblage • Save up to 20% system space • Reduce total cost ownership MI/O e MIOe

  30. MI/O Extension Mechanical Placement Component Side Solder Side • Expansion Slots on Solder Side • MIOe Expansion • miniPCIe expansion • CF/Cfast card (can take the card away from rear I/O) • Hard Disk Placement • Hard disk on solder side prevents thermal issues • Saves system space. • SMD Lockable Connectors • Lockable connector type on COM & audio. • Heat Generating Parts on Component Side • Including CPU, South bridge, memory, power, active IC… • solve the thermal issues on one side • Thermal Solution • Larger space for better thermal result.. • Reduced tooling fee with minimum CNC rework. • Coast Line and DIP connectors • Saves production costs • Right angle DIP connectors (Power)

  31. Rear I/O Placement 2USBs DC Power 2USBs HDMI CRT LED 2 GbEs • With minimum cabling needed • LVDS cable • SATA cable • COM cable • Audio cable

  32. MI/O Extension(Multiple I/O) New Form Factor Install Heat Spreader Install Hard Disk Heat Spreader Install MIOe MIO MI/O Screws MIOe Hard Disk

  33. Flexibility Possibilities MI/O Extension SBC+ MIOe Expansion Module = Vertical Applications MIOe Module A MI/O A MIOe Module B MI/O B MIOe Module C Your own MIOe design !

  34. Unified MIOe for MIO Extension SBC Interfaces are considered including most demands from customer andfuture chipset trends

  35. MIO Positioning Easy System Integration Cost Effective Minimum Design Effort MIO Secure Core Knowledge Flexibility/ Vertical Market Compact Chassis Design

  36. Contact product manager for any further information Sandy.Chen@advantech.com.tw Thank you!

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