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Wafer Level Packaging Market to Reach $7.8 Billion, Globally, by 2022 PowerPoint PPT Presentation


A new report published by Allied Market Research, titled, Wafer Level Packaging Market, Opportunities and Forecast, 20142022, the global wafer level packaging market is expected to garner $7.8 billion by 2022, growing at a CAGR of 21.5% from 2016 to 2022. In the year 2015, Asia-Pacific dominated the global market and contributed over half of the market share owing to improved electronics industry infrastructure and increasing demand of electronic products such as smartphones, handheld devices, PCs and laptops among others.Wafer level packaging is growing with a notable rate owing to its competitive advantages over other conventional packaging technologies namely wire bonding and flip chip such as compact package footprints, increased functionality, improved thermal performance, and finer pitch interconnection to the printed circuit board. Wafer level packaging (WLP) can be categorized on the basis of integration type and packaging technology used in them.

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Wafer Level Packaging Market to Reach $7.8 Billion, Globally...

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Wafer level packaging market to reach 7 8 billion globally by 2022

Graphene Batter Market

Wafer Level Packaging Market

Flip Chip Market

Opportunities and Forecasts,

2014 – 2022

2014 – 2022

Opportunities and Forecasts,

2014 – 2022

Opportunities and Forecasts,

Opportunities and Forecasts,

2014 – 2022

Report - https://www.alliedmarketresearch.com/wafer-level-packaging-market

Publish Date : Aug 2016 No of Pages:179


Wafer level packaging market to reach 7 8 billion globally by 2022

Wafer Level Packaging Market - Introduction

A new report published by Allied Market Research, titled, Wafer Level Packaging Market,

Opportunities and Forecast, 20142022, the global wafer level packaging market is expected to garner

$7.8 billion by 2022, growing at a CAGR of 21.5% from 2016 to 2022. In the year 2015, Asia-Pacific

dominated the global market and contributed over half of the market share owing to improved

electronics industry infrastructure and increasing demand of electronic products such as

smartphones, handheld devices, PCs and laptops among others.

Wafer level packaging is growing with a notable rate owing to its competitive advantages over other

conventional packaging technologies namely wire bonding and flip chip such as compact package

footprints, increased functionality, improved thermal performance, and finer pitch interconnection to

the printed circuit board. Wafer level packaging (WLP) can be categorized on the basis of integration

type and packaging technology used in them.

Furthermore, trending Internet of Things (IoT), technological superiority over traditional packaging

techniques, and impending need of circuit miniaturization in microelectronic devices are key factors

expected to propel the growth of global WLP market. Thriving demand for small sizes, low costs, and

high performance of packaging solutions in electronic devices is going to act as an opportunity for

wafer level packaging market.

Download Sample - https://www.alliedmarketresearch.com/request-free-sample/1694


Wafer level packaging market to reach 7 8 billion globally by 2022

Wafer Level Packaging Market - Key Benefits

 Comprehensive analysis of the current and future trends in

the world wafer level packaging market are provided

 The report offers a competitive scenario of the market and

elucidates on the growth trends, driving factors, scope,

opportunities, and challenges

 The report includes a comprehensive analysis of the key

segments to provide insights on the market dynamics

 Porter’s Five Forces analysis highlights the potential of buyers

and suppliers as well as provides insights on the competitive

structure of the market to devise effective growth strategies

and facilitate better decision-making

 Value chain analysis provides key inputs on the role of

stakeholders involved at various stages of the value chain


Wafer level packaging market to reach 7 8 billion globally by 2022

Wafer Level Packaging Market - Table of Contents

1. INTRODUCTION

2. EXECUTIVE SUMMARY

3. MARKET OVERVIEW

4. WAFER LEVEL PACKAGING MARKET, BY INTEGRATION TYPE

5. WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY

6. WAFER LEVEL PACKAGING MARKET, BY BUMPING TECHNOLOGY

7. WAFER LEVEL PACKAGING MARKET, BY INDUSTRY

8. WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY

9. COMPANY PROFILES


Wafer level packaging market to reach 7 8 billion globally by 2022

Wafer Level Packaging Market - By Factors And Their

Expected Impact


Wafer level packaging market to reach 7 8 billion globally by 2022

Wafer Level Packaging Market - By Technology

• 3D TSV WLP

• 2.5D TSV WLP

• WLCSP

• Nano WLP

By Packaging

Technology

• Copper Pillar

• Solder Bumping

• Gold Bumping

• Others (Aluminum & Conductive

Polymer Bumping)

By Bumping

Technology


Wafer level packaging market to reach 7 8 billion globally by 2022

Wafer Level Packaging Market - By Industry

Electronics

IT &

Telecomm

unication

Others

Wafer Level

Packaging

Market – By

Industry

Healthcare

Industrial

Aerospace &

Defense

Automotive


Wafer level packaging market to reach 7 8 billion globally by 2022

Wafer Level Packaging Market - By Geography

North America, Europe, Asia Pacific, LAMEA


Wafer level packaging market to reach 7 8 billion globally by 2022

Company Profiles

1. Amkor Technology, Inc.

2. Fujitsu

3. Jiangsu Changjiang Electronics Technology Co. Ltd.

4. Deca Technologies

5. Qualcomm Technologies, Inc.

6. Toshiba Corporation

7. Tokyo Electron Ltd.

8. Applied Materials, Inc.

9. ASML Holding N.V

10. Lam Research Corporation


Wafer level packaging market to reach 7 8 billion globally by 2022

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https://www.alliedmarketresearch.com/wafer-level-

packaging-market

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