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Wafer Level Packaging Market to Reach $7.8 Billion, Globally, by 2022

A new report published by Allied Market Research, titled, Wafer Level Packaging Market, Opportunities and Forecast, 20142022, the global wafer level packaging market is expected to garner $7.8 billion by 2022, growing at a CAGR of 21.5% from 2016 to 2022. In the year 2015, Asia-Pacific dominated the global market and contributed over half of the market share owing to improved electronics industry infrastructure and increasing demand of electronic products such as smartphones, handheld devices, PCs and laptops among others.<br><br>Wafer level packaging is growing with a notable rate owing to its competitive advantages over other conventional packaging technologies namely wire bonding and flip chip such as compact package footprints, increased functionality, improved thermal performance, and finer pitch interconnection to the printed circuit board. Wafer level packaging (WLP) can be categorized on the basis of integration type and packaging technology used in them.

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Wafer Level Packaging Market to Reach $7.8 Billion, Globally, by 2022

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  1. Graphene Batter Market Wafer Level Packaging Market Flip Chip Market Opportunities and Forecasts, 2014 – 2022 2014 – 2022 Opportunities and Forecasts, 2014 – 2022 Opportunities and Forecasts, Opportunities and Forecasts, 2014 – 2022 Report - https://www.alliedmarketresearch.com/wafer-level-packaging-market Publish Date : Aug 2016 No of Pages:179

  2. Wafer Level Packaging Market - Introduction A new report published by Allied Market Research, titled, Wafer Level Packaging Market, Opportunities and Forecast, 20142022, the global wafer level packaging market is expected to garner $7.8 billion by 2022, growing at a CAGR of 21.5% from 2016 to 2022. In the year 2015, Asia-Pacific dominated the global market and contributed over half of the market share owing to improved electronics industry infrastructure and increasing demand of electronic products such as smartphones, handheld devices, PCs and laptops among others. Wafer level packaging is growing with a notable rate owing to its competitive advantages over other conventional packaging technologies namely wire bonding and flip chip such as compact package footprints, increased functionality, improved thermal performance, and finer pitch interconnection to the printed circuit board. Wafer level packaging (WLP) can be categorized on the basis of integration type and packaging technology used in them. Furthermore, trending Internet of Things (IoT), technological superiority over traditional packaging techniques, and impending need of circuit miniaturization in microelectronic devices are key factors expected to propel the growth of global WLP market. Thriving demand for small sizes, low costs, and high performance of packaging solutions in electronic devices is going to act as an opportunity for wafer level packaging market. Download Sample - https://www.alliedmarketresearch.com/request-free-sample/1694

  3. Wafer Level Packaging Market - Key Benefits  Comprehensive analysis of the current and future trends in the world wafer level packaging market are provided  The report offers a competitive scenario of the market and elucidates on the growth trends, driving factors, scope, opportunities, and challenges  The report includes a comprehensive analysis of the key segments to provide insights on the market dynamics  Porter’s Five Forces analysis highlights the potential of buyers and suppliers as well as provides insights on the competitive structure of the market to devise effective growth strategies and facilitate better decision-making  Value chain analysis provides key inputs on the role of stakeholders involved at various stages of the value chain

  4. Wafer Level Packaging Market - Table of Contents 1. INTRODUCTION 2. EXECUTIVE SUMMARY 3. MARKET OVERVIEW 4. WAFER LEVEL PACKAGING MARKET, BY INTEGRATION TYPE 5. WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY 6. WAFER LEVEL PACKAGING MARKET, BY BUMPING TECHNOLOGY 7. WAFER LEVEL PACKAGING MARKET, BY INDUSTRY 8. WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY 9. COMPANY PROFILES

  5. Wafer Level Packaging Market - By Factors And Their Expected Impact

  6. Wafer Level Packaging Market - By Technology • 3D TSV WLP • 2.5D TSV WLP • WLCSP • Nano WLP By Packaging Technology • Copper Pillar • Solder Bumping • Gold Bumping • Others (Aluminum & Conductive Polymer Bumping) By Bumping Technology

  7. Wafer Level Packaging Market - By Industry Electronics IT & Telecomm unication Others Wafer Level Packaging Market – By Industry Healthcare Industrial Aerospace & Defense Automotive

  8. Wafer Level Packaging Market - By Geography North America, Europe, Asia Pacific, LAMEA

  9. Company Profiles 1. Amkor Technology, Inc. 2. Fujitsu 3. Jiangsu Changjiang Electronics Technology Co. Ltd. 4. Deca Technologies 5. Qualcomm Technologies, Inc. 6. Toshiba Corporation 7. Tokyo Electron Ltd. 8. Applied Materials, Inc. 9. ASML Holding N.V 10. Lam Research Corporation

  10. Thank You Thank You! For More Details Visit us at https://www.alliedmarketresearch.com/wafer-level- packaging-market Follow Us On

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