A new report published by Allied Market Research, titled, "Flip Chip Market - Global Opportunity Analysis and Industry Forecast, 2014 - 2022", the flip chip market is expected to garner $46 billion by 2022, growing at a CAGR of 9% from 2016 to 2022. In the year 2015, Asia-Pacific dominated the global flip chip market and contributed over half of the market share owing to thriving market for semiconductors and electronic devices.
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Opportunities and Forecasts,
2014 – 2022
Publish Date : Aug 2016 No of Pages: 204
A new report published by Allied Market Research, titled, "Flip Chip Market - Global Opportunity
Analysis and Industry Forecast, 2014 - 2022", the flip chip market is expected to garner $46 billion by
2022, growing at a CAGR of 9% from 2016 to 2022. In the year 2015, Asia-Pacific dominated the global
flip chip market and contributed over half of the market share owing to thriving market for
semiconductors and electronic devices.
Flip chips majorly differ from each other on the basis of bumping technology used in them. Currently,
copper bumping is extensively used in market owing to its advantages such as considerably low cost
than other methods, high efficiency and compatibility with bond pads. Furthermore, impending need
of circuit miniaturization, thriving portable devices industry and technological superiority over wire
bond connections are major factors expected to propel the growth in global flip chip market.
However, availability of less customization options as well as high capital investment requirements for
setting up a new plant are the limitations that restrict the market growth.
2.5D IC packaging technology dominated the overall market in 2015 owing to its several advantages
such as enhanced capacity, improved performance, and reduced system space requirements and low
power consumption. 3D IC is expected to register highest CAGR as it is equipped with all the
advantages of 2.5D IC as well as some additional advantages.
Read more details of the report at: https://www.alliedmarketresearch.com/flip-chip-market
Flip Chip Market – Segment Review
In 2015, copper pillar led the overall flip chip market revenue, and is
projected to grow at a CAGR of 9.8% during the forecast period.
Tin-lead eutectic solder is expected to witness low growth rate due
to government initiatives to ban toxic substances that have impacted
its market heavily.
Electronics industry constituted significant share in the overall flip
chip market in the year 2015 due to imminent need of size reduction
in electronics devices, requirement of higher data transmission
speed and improvement in efficiency.
In packaging technology of flip chips, 2.5D IC packaging dominated
the market in 2015.
Asia-Pacific dominated the market in the year 2015 by accounting
over 50% of the total market revenue.
2. EXECUTIVE SUMMARY
3. MARKET OVERVIEW
4. FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY
5. FLIP CHIP MARKET, BY INDUSTRY
6. FLIP CHIP MARKET, BY BUMPING TECHNOLOGY
7. FLIP CHIP MARKET BY GEOGRAPHY
8. COMPANY PROFILES
1. Market Definition and Scope
2. Key findings
3. Porters five force analysis
4. Value chain analysis
5. Market share analysis
North America, Europe, Asia Pacific, LAMEA
1. International Business Machines Corporation (IBM)
3. Texas Instruments, Inc.
4. Taiwan Semiconductor Manufacturing Company Ltd.
5. Apple Inc.
7. Intel Corporation
8. Advanced Micro Devices, Inc.
9. Amkor Technology, Inc.
10. Samsung Electronics Co. Ltd.
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