Loading in 2 Seconds...
Loading in 2 Seconds...
Future Market Insights has announced the addition of the “Ball Grid Array (BGA) Packaging Market: Global Industry Analysis and Opportunity Assessment 2016-2026\" report to their offering.
Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author.While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server.
FutureMarket Insights (FMI) is apremier provider of syndicated research reports, custom research reports, andconsulting
services. We deliver a complete packaged solution, which combines current market intelligence, statistical anecdotes,
Weprovideresearchservicesat aglobalas wellas regionallevel;keyregionsincludeGCC, ASEAN,andBRIC.
Our offerings cover a broad spectrum of industries including Chemicals, Materials, Energy, Technology, Healthcare, and
We have a global presence with delivery centers across India specializing in providing global research reports and country
research reports. FMI is headquartered out of London, U.K., with a state-of-the-art delivery center located in Pune, India.
We combine our knowledge and learning from every corner of the world to distill it to one thing – the perfect solution for
Automotive and Transportation
Electronics, Semiconductor, and ICT
Retail and Consumer Products
Industrial Automation and Equipment
Social Media Research
Chemicals & Materials
Food and Beverages
Services and Utilities
Energy, Mining, Oil, and Gas
For detailed subscription information please contact
Hari. T (Sr. Manager -Global Business Development)
T: +44 (0) 20 7692 8790 | D: +44 20 3287 4268
Email: [email protected]
Surface mount technology also called as SMT is a technique of mounting electronic
components on the surface of printed circuit boards. Ball Grid Array also called as BGA is
one of the types of surface mount packaging. BGA are more convenient and robust type
of packages compared to the conventional packaging such as quad flat packaging. The
BGA are usually used widely in high-performance applications where high electrical and
the thermal requirement is a top priority. BGA are available in plastic, ceramic and tape
type of materials. The plastic BGA and thermally enhanced BGA are widely adopted. The
BGA has enhanced ratio between PCB area and pin count due to the input and output
connections. Besides, the solder balls are strong than the conventional packaging,
provides reduced footprint, increased speed yield of integrated circuits. The global BGA
market is expected to grow during the forecast period due growth in the system on the
The BGA market is driven rapidly due to its low cost, denser type of packing and also
higher performance. The increasing demand for diverse and smaller size packaging from
electronic OEM’s drives the global BGA market. Also, increasing semiconductor and IC
chip industry drives the global BGA market.
Request Free Report
[email protected] http://www.futuremarketinsights.com/reports/sample/rep-gb-2038
However, the challenges in designing of BGA are critical which might restrain the global
The global BGA market is segmented on the basis material type and BGA type.
Based on the material type of BGA, global BGA market is segmented into:
Based on the type of BGA, global BGA market is segmented into:
Molded Array Process BGA
Thermally Enhanced BGA
Package on Package (PoP) BGA
Request For [email protected] http://www.futuremarketinsights.com/toc/rep-gb-2038
The global BGA market is geographically divided into five key regions including North
America, Latin America, Europe, Asia-Pacific (APAC) and the Middle East & Africa
(MEA).Asia Pacific, especially China, Taiwan, Hong Kong, Japan contributes majorly to the
BGA market. The semiconductor industry in Asian countries has the strong foothold, thus
it is expected that BGA market will show strong growth during the forecast period.
Followed by APAC are North America, Europe, Latin America and MEA.
Ball Grid Array (BGA) Packaging Market - Major Players:
Some of the key players identified in the global BGA packaging market are Amkor
Technology, TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology Co.
STATS ChipPAC Ltd., ASE Group, Advanced Semiconductor Engineering, Inc., PARPRO,
Browse Full [email protected]