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Future Market Insights has announced the addition of the “Ball Grid Array (BGA) Packaging Market: Global Industry Analysis and Opportunity Assessment 2016-2026" report to their offering.

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Good growth opportunities in global ball grid array bga packaging market till 2026

Global Ball Grid Array (BGA)

Packaging Market

Share, Global Trends,

Analysis, Research, Report,

Opportunities,

Segmentation and Forecast,

2016-2026

Future Market Insights

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Good growth opportunities in global ball grid array bga packaging market till 2026

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Good growth opportunities in global ball grid array bga packaging market till 2026

Report Description

Report Description

Surface mount technology also called as SMT is a technique of mounting electronic

components on the surface of printed circuit boards. Ball Grid Array also called as BGA is

one of the types of surface mount packaging. BGA are more convenient and robust type

of packages compared to the conventional packaging such as quad flat packaging. The

BGA are usually used widely in high-performance applications where high electrical and

the thermal requirement is a top priority. BGA are available in plastic, ceramic and tape

type of materials. The plastic BGA and thermally enhanced BGA are widely adopted. The

BGA has enhanced ratio between PCB area and pin count due to the input and output

connections. Besides, the solder balls are strong than the conventional packaging,

provides reduced footprint, increased speed yield of integrated circuits. The global BGA

market is expected to grow during the forecast period due growth in the system on the

package.

The BGA market is driven rapidly due to its low cost, denser type of packing and also

higher performance. The increasing demand for diverse and smaller size packaging from

electronic OEM’s drives the global BGA market. Also, increasing semiconductor and IC

chip industry drives the global BGA market.

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However, the challenges in designing of BGA are critical which might restrain the global

BGA market.


Good growth opportunities in global ball grid array bga packaging market till 2026

Report Description

Report Description

The global BGA market is segmented on the basis material type and BGA type.

Based on the material type of BGA, global BGA market is segmented into:

Ceramic/ (CBGA)

Plastic/ (PBGA)

Tape/ (TBGA)

Based on the type of BGA, global BGA market is segmented into:

Molded Array Process BGA

Thermally Enhanced BGA

Package on Package (PoP) BGA

Micro BGA

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The global BGA market is geographically divided into five key regions including North

America, Latin America, Europe, Asia-Pacific (APAC) and the Middle East & Africa

(MEA).Asia Pacific, especially China, Taiwan, Hong Kong, Japan contributes majorly to the

BGA market. The semiconductor industry in Asian countries has the strong foothold, thus

it is expected that BGA market will show strong growth during the forecast period.

Followed by APAC are North America, Europe, Latin America and MEA.


Good growth opportunities in global ball grid array bga packaging market till 2026

Report Description

Report Description

Ball Grid Array (BGA) Packaging Market - Major Players:

Some of the key players identified in the global BGA packaging market are Amkor

Technology, TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology Co.

STATS ChipPAC Ltd., ASE Group, Advanced Semiconductor Engineering, Inc., PARPRO,

etc.

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Good growth opportunities in global ball grid array bga packaging market till 2026

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