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Hermetic Packaging Market Trends, Technology Innovations and Growth Prediction -

The global hermetic packaging market has been marked by notable developments, including new product launches and collaborations. For instance, in 2021, Avalanche Technology and Micross Components Inc. joined forces to provide Power Hi-Rel Non-Volatile Memory solutions, particularly for aerospace applications.

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Hermetic Packaging Market Trends, Technology Innovations and Growth Prediction -

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  1. The hermetic packaging market is poised for significant growth in the near future, backed by promising trends and emerging opportunities. A recent report offers valuable insights into the anticipated expansion of this market. Protection of Sensitive Electronics Boosts Market Growth In the ever-evolving landscape of technology and electronics, the demand for hermetic packaging is on the rise. Hermetic packaging plays a pivotal role in safeguarding sensitive electronic components against external environmental factors such as pressure, humidity, and other hazards. This essential protection extends to the electrical circuits within electronic devices, making hermetic packaging a crucial solution in the packaging of electronic products and consumer electronics. Additionally, this packaging method serves as a barrier against the intrusion of gases and liquids, while exhibiting exceptional resilience to extreme temperatures, setting it apart from other packaging types. With the electronics sector experiencing substantial growth, the demand for efficient packaging solutions is escalating, thereby auguring well for the hermetic packaging market. Unlocking New Growth Opportunities: Implantable Medical Devices Implantable medical devices have become lifelines for many, enhancing and even saving lives by restoring body functions. These life-critical devices, such as cochlear implants, neuromuscular microstimulators, implantable cardiac defibrillators, and artificial vision prostheses, incorporate sophisticated electronic circuits. However, these long-term implantable devices are susceptible to critical damage caused by exposure to bodily fluids over time. Thus, it is imperative to protect these devices from the corrosive effects of bodily elements using advanced packaging solutions, including hermetic packaging. Modern advancements in microtechnology have led to the miniaturization of smart devices, but this has come with an increased level of integration complexities. As a result, the compact and reliable packaging of microelectronic devices and components has become a high priority. This shift has created significant opportunities in the medical field, where hermetic packaging is employed to protect implantable medical devices from external harm. The improved protection offered by hermetic packaging for the electronic circuitry within implantable devices has fueled its adoption in the medical devices sector, opening up new potential pathways for market growth. Surging Demand for Reed Glass Reed glass hermetic packaging is expected to witness a surge in demand in the years ahead. This popularity is attributed to its functional properties that have fueled adoption across a multitude of applications, underpinned by its highly reliable encapsulation. Reed glass is primarily used in the insulation of passive components, while providing isolation and protection. Its appeal stems from characteristic features such as a high dielectric rating, superior attachment characteristics to metal surfaces, exceptional mechanical stability across a range of operating temperatures, and superior electrical insulation. These qualities have made reed glass a preferred choice in the automotive sector, particularly for vehicles' centralized locking systems. Reed switches, a key component of this technology, can conveniently handle a large number of make and break cycles without wear and can open and close electrical circuits without any mechanical influence. With the increasing use of reed glass in diverse industrial applications, its adoption is expected to complement the revenue growth of the hermetic packaging market.

  2. North America: A Dominant Player in the Hermetic Packaging Market Regionally, North America is projected to maintain a substantial revenue share in the hermetic packaging market. The expansion of the aviation sector, coupled with the growing semiconductor industry in the region, has positioned North America as a key player in this market. Furthermore, the region's increased government spending on aerospace and defense initiatives is set to drive market growth. For instance, the United States Department of Defense reported a budget of USD 722 billion for defense in 2022, marking a USD 17 billion increase compared to the previous year. In 2023, this budget is expected to surpass USD 737 billion, providing new opportunities for the adoption of hermetic packaging in defense applications. Additionally, rising consumer spending on electronics and the widespread adoption of smartphones are expected to drive the market. In the United States, consumer electronics retail sales reached USD 442 billion, with smartphones accounting for a significant share. Hermetic packaging is increasingly being used to provide enhanced protection for electronic components, guarding against factors such as humidity, moisture, soil, and atmospheric changes, including pressure and temperature fluctuations. Other contributing factors include the high demand for semiconductor silicon wafers, stable growth in the automotive sector, the presence of key players, and a consistent increase in economic growth, all of which continue to positively influence the hermetic packaging market. Overall, North America represents a promising landscape for the market, with manufacturers poised to explore potential opportunities in the region in the years ahead. Competitive Landscape The global hermetic packaging market has been marked by notable developments, including new product launches and collaborations. For instance, in 2021, Avalanche Technology and Micross Components Inc. joined forces to provide Power Hi-Rel Non-Volatile Memory solutions, particularly for aerospace applications. In 2022, SCHOTT unveiled new hermetic packaging components known as SCHOTT LightView packaging components, which serve to miniaturize and enhance opto-electronic performance for light engine systems. Key players in the global hermetic packaging market include SCHOTT AG, Teledyne Technologies Incorporated, Ametek Inc., Materion Corporation, Micross Components Inc., Amkor Technology Inc., Kyocera Corporation, Texas Instruments Incorporated, Palomar Technologies, Complete Hermetics, and Special Hermetic Products Inc. Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2023-2030 - By Product, Technology, Grade, Application, End-user, Region: (North America, Europe, Asia Pacific, Latin America and Middle East and Africa): https://www.fairfieldmarketresearch.com/report/hermetic-packaging-market Our blog: hermetic packaging market: https://www.linkedin.com/posts/shakshi-kaurav-0294a8296_hermeticpackaging-electronicsprotection- medicaldevicepackaging-activity-7119932761955553280- WrAv?utm_source=share&utm_medium=member_desktop

  3. Contact Fairfield Market Research London, UK UK +44 (0)20 30025888 USA (Toll-free) +1 (844) 3829746 Web: https://www.fairfieldmarketresearch.com/ Email:sales@fairfieldmarketresearch.com LinkedIn | Twitter

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