Today s objectives soldering
Download
1 / 14

Today - PowerPoint PPT Presentation


  • 234 Views
  • Uploaded on

Today’s Objectives: Soldering . Soldering is non-trivial, especially surface mount components Goals: good physical connection; electrical and thermal connectivity Technique: heat both parts of joint first. (Don’t paint with solder!) Avoid oxidation – the joint should be shiny. .

loader
I am the owner, or an agent authorized to act on behalf of the owner, of the copyrighted work described.
capcha
Download Presentation

PowerPoint Slideshow about 'Today' - Philip


An Image/Link below is provided (as is) to download presentation

Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author.While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server.


- - - - - - - - - - - - - - - - - - - - - - - - - - E N D - - - - - - - - - - - - - - - - - - - - - - - - - -
Presentation Transcript
Today s objectives soldering l.jpg
Today’s Objectives: Soldering

  • Soldering is non-trivial, especially surface mount components

    • Goals: good physical connection; electrical and thermal connectivity

  • Technique: heat both parts of joint first. (Don’t paint with solder!) Avoid oxidation – the joint should be shiny.


Slide2 l.jpg

Printed circuit board copper tracks must be clean to begin with, especially if they're not previously "tinned" with solder. Clean any raw p.c.b. copper tracks gently with e.g. an abrasive rubber block available from electronics suppliers.



Slide4 l.jpg

A useful product is Multicore's Tip Tinner Cleaner (TTC) - a 15 gramme tin of

special paste which cleans and "tins" the soldering iron, in one go. New tips must be tinned immediately when used for the first time.



Slide6 l.jpg

It's usually best to snip the electronic component wires to length prior to soldering. This helps prevent transmitting mechanical shocks to the copper foil.


Slide7 l.jpg

Apply a clean soldering iron tip to the copper solder pad and the component lead, in order to heat both items at the same time.


Slide8 l.jpg

Continue heating and apply a few millimeters of solder. Remove the iron and allow the solder joint to cool naturally.



Slide10 l.jpg

An example of a "dry" or "gray" soller joint - the solder failed to flow, and instead beaded to form globules around the wire.


More on soldering l.jpg
More on Soldering: failed to flow, and instead beaded to form globules around the wire.

  • Use the lowest heat that will work (about 650 F)

  • Keep iron tip clean and shiny.

  • Store with solder on it. Never “sharpen” tip.

    • Minimize heating time (avoids oxidation, damaging sensitive components)

    • Contact shouldn’t be more than 2-3 seconds Let components cool for a few seconds


Bad soldering l.jpg
Bad Soldering failed to flow, and instead beaded to form globules around the wire.

  • A tenfold excess of solder on this hand-soldered printed circuit board, and (extreme left) an incomplete solder joint with poor coverage. There is no need to add more solder "for luck".


Slide14 l.jpg


ad