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Agenda

Agenda. IA D ual P rocessors Motherboard Intel 5520/5500 chipset based MB update IA Uni Processor Motherboard Intel 3400 chipset based MB update UP ATOM/Embedded MB update A+ Motherboard G34/C32 MB update IA Quad Processors Motherboard Networking Solution. IA DP Motherboards. 2.

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Agenda

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  1. Agenda • IA Dual Processors Motherboard • Intel 5520/5500 chipset based MB update • IA Uni Processor Motherboard • Intel 3400 chipset based MB update • UP ATOM/Embedded MB update • A+ Motherboard • G34/C32 MB update • IA Quad Processors Motherboard • Networking Solution

  2. IA DP Motherboards 2

  3. 18 DIMM High-End Server X8DTN+ 18 DIMM/UIO/PCI-X X8DTN+-F 18 DIMM/UIO/IPMI • General Server • Database • Application Server HPC Finance Simulation

  4. Dual IOH High-End WS/GPU X8DAH+-F 18 DIMM/Dual IOH X8DTG-QF 4 GPU/Dual IOH • High-End Workstation • Database server • Storage Appliance • Head Node controller • GPU cluster • High-End Workstation • Medical machine • Head Node controller

  5. Dual IOH/SAS2 X8DTH-6(F)/i(F) • New Features Provide Enhanced Levels of Performance • Dual IOH-36D support up to 72 PCI-E 2.0 links • 7 PCI-E 2.0 x8 slots • SAS II (6Gb/s) • EATX design (12”x13”) • On-board IPMI 2.0 & KVM with dedicated Lan support (F version) • Chassis support; SC213A, SC825TQ, SC836TQ/E1, SC745 • Applications • Storage Appliance • Security surveillance system • Medical machine • Mulit-display systems

  6. Points to Remember • 18 DIMM & Dual IOH • 192GB of memory support (X8DTN+-F/X8DTN+/X8DAH+(-F)) • Up to 72 PCI-E 2.0 links (X8DAH+(-F)/X8DTH-6/i(F)/X8DTG-QF) • 4 GPU support (X8DTG-QF) • High-End Enterprise/HPC segment • 7yrs embedded life • Onboard IPMI 6

  7. Innovative Twin X8DTT(F)/IBX(F)/IBQ(F) • New Features Provide Enhanced Levels of Performance • Twin in 1U and Quad in 2U • PCI-E 2.0 x16 slots for expansion • DDR or QDR IB onboard • 6 phases VRM design for max efficiency • On-board IPMI 2.0 & KVM with dedicated Lan support (F version) • Chassis support; SC808T, SC809T • Applications • HPC/Clusters • Head Node controller • Datacenter • Hosting Center

  8. 2U Hot Swap X8DTT-H(F)+/-HIBX(F)+/-HIBQ(F)+ • New Features Provide Enhanced Levels of Performance • Hot swap Twin design for 2U • PCI-E 2.0 x16 slots for expansion • DDR or QDR IB onboard • 6 phases VRM design for max efficiency • On-board IPMI 2.0 & KVM with dedicated Lan support (F version) • Chassis support; SC827 series • Applications • HPC/Clusters • Head Node controller • Datacenter • Hosting Center

  9. Award-Winning UIO Architecture X8DTU-F UIO for 1U/2U X8DTU-6TF+ 18 DIMM/SAS2/10G X8DTU-LN4F+ 18 DIMM/GPU/4LAN

  10. Points to Remember • UIO • 3 add-on card for 1U/ 6 for 2U (X8DTU-LN4F+) • SAS2/10Gb support for 1U/2U (X8DTU-6TF+) • IPMI w/ dedicated lan • GPU support (X8DTU-LN4F+) • Appliance/HPC/Finance/Oil & gas segment • long life with 7yrs embedded life • 50+ riser cards for flexibility • 20+ different UIO cards (SAS2/SAS/NIC/10Gb/IB…) 10

  11. Mainstream boards • Dual Nehalem-EP/Westmere CPU support • UP to 12 DIMM to support 192GB Reg. ECC/48GB Unb ECC/Non-ECC DDR3 • SAS2, SAS, SATA, and 4Lans to support different enterprise platform • PCI-E 2.0 and PCI-X slots for added flexibility • IPMI/KVM-F version (w/ dedicated LAN) • ATX and EATX form factor to fit our building block solution • Applications; Appliance-(Storage, NAS), HPC, Oil & Gas, Financial, Database X8DTL-3/6F X8DT3/i-LN4F X8DAL X8DT6/E(F) X8DA6/E X8DA3/i 11

  12. IA UP Motherboards 12

  13. Supermicro Has the Solution X8SIA-F X8SIL-F X8SIU-F 1U/2U UIO Support Small BusinessHome Office Max I/O FlexibilityGeneral Purpose Server X8SIE-F / X8SIE-LN4 X8SI6-F X8SIT-F 1U OptimizedRack and Data Center SAS 2.0 SupportStorage Server 1U Twin™ and 2U Twin2 HPC and Cloud Computing 13

  14. Super X8SIT-HF • Intel® Xeon® 3400 Processor Series • Intel® 3420 Platform Controller Hub • Integrated Memory Controller • ECC DDR3 Memory at 1333/1066/800 MHz • Up to 32 GB RDIMMs or 16 GB UDIMMs • Three DIMMs per Channel in 6 DIMM Sockets • 1 PCI-E 2.0 x16 (graphics or I/O) or 2 x8 slot (I/O) • 1 PCI-E x4 • 6 SATA ports with RAID 0,1, 5, 10 • Intel 82576EB Dual Port Gigabit LAN • Integrated IPMI 2.0 with Dedicated LAN (-F only) • Integrated Matrox G200eW Graphics • 7 USB (2 rear, 1 on-board, 4 via 2 headers) • 6.8” x 16.4 ” Form Factor • Supports 2U Twin with Cableless hot-swap

  15. X7SPA-H /-HF(ATOM) • Target Market • Entry, Home Storage Server • Home Office, Embedded Applications • Key Features • D510 Dual-Core CPU • CPU FAN Less Design • 6 SATA with RAID 0, 1, 5, 10 • Dual Intel 82574L Gb LAN • IPMI 2.0 with Shared LAN (-HF only) • Compliance • EuP, FCC B Supported • 0 ~ 55 degree C Operation Temperature 15

  16. X7SPE-H /-HF(ATOM) • Intel D510 1.66Ghz, Dual-Core CPU, FAN-Less Design • Intel ICH9R Express Chipset • Intel Integrated GMA3150 Graphics (for - H version) • Matrox G200eW Graphics Accelerator (for - HF version) • Up to 4 GB, Non-ECC, by DDR2-667MHz SO-DIMM • 6 SATA ports (RAID 0/1/5/10) • 1 PCI-E x4 (x16 in Slot 6) • Dual Intel 82574L Gigabit LAN • Integrated IPMI 2.0, share LAN1 port (-HF only) • 2 Com Ports, 1 rear and 1 by header • 8 USB 2.0 ports, 2 rear, 1 Type-A and 5 by headers • DOM (Disk on Module) Power Connector on board • PCB Size: 7.5” X 6.75” • FCC Class B, EuP Ready • Chassis Optimized for 1U (502L, 503L, 510, 512) and SC731 • Sample Schedule: now. • Production Schedule: now.

  17. X7SPE v.s. X7SPA

  18. X7SPE-H(F)-D525 • Integrated Intel Pineview-D D525, Dual Core, 1.8Ghz (13W) CPU • Intel ICH9R (4.3W) Express Chipset • Intel Integrated Graphics (-H), or BMC Graphic (-HF) • 4 GB None-ECC DDR3-800MHz SO-DIMM • 1 PCI-E x4 (in x16) • 6 SATA ports (RAID 0/1/5/10) • Dual Intel 82574L Gigabit LAN • IPMI 2.0 (-HF only) – share LAN1 • 2 COM Ports (1x rear and 1x header ) • 8 USB 2.0 ports (1 Type-A + 2.5 header (5 ports) + 2 rear) • 7.5” X 6.75” PCB Size. 1U Optimized design. • TPM 20-pin header ready. • 4pin 12V DC option (for OEM SKU only) • Two 4-pin Fan Connectors. • DOM (Disk on Module) Power Connector ready. • 24pin ATX power connector

  19. Super C7SIM-Q • Designed for Embedded Market • Operating Temp: 0° to 55 ° C • Long Life: 7 year availability • EU Directive (EuP) low power state • Enhanced Connectivity • Dual 1 Gbit LAN ports • DVI-D + VGA output • 14 USB 2.0 ports • Advanced Technologies • Intel® Turbo Boost Technology • Intel® vPRO™ Technology • Intel Active Management Technology • Supports TPM 1.2 C7SIM-Q (Q57 chipset)

  20. A+ Motherboard 20

  21. H8QG6/i(+)-F • Quad AMD Socket G34 Opteron 6000 series (8/12 core ready) with 4-way option in 1U/2U/4U configuration • 3.2 GHz HyperTransport (HT3) Link • 512 GB U/RDDR3 ECC DDR3 1333/1066 in 32 DIMM • 2 G-bit LAN (Intel 82576 Kawela) • Winbond WPCM450 IPMI 2.0 Support • 16.48” x 13” for 1U, 2U, and 4U support (SC818, SC828, SC748) Applications: High-end HPC, HPC clustering, Medical, Engineering intensive server, and Labs 21

  22. H8DGU(-F) (UIO server) • Dual AMD Socket G34 6000 series Opteron (8/12 Core ready) • 3.2 GHz HyperTransport (HT3) Link • 256GB U/RDDR3 ECC 1333/1066 in 16 DIMMs • 2 G-bit LAN (Intel 82576 Kawela) • Winbond WPCM450 IPMI 2.0 Support • 12.1” x 13”, 1U, 2U UIO (SC815, SC113, SC825, SC826, SC213, SC216) Applications: Appliance server, Application server, HPC, Storage, and Database

  23. H8DGU-LN4F+ (UIO server) • Dual AMD Socket G34 6000 series Opteron (8/12 Core ready) • AMD SR5690/SP5100 Chipset • 3.2 GHz HyperTransport (HT3) Link • Up to 256GB U/RDDR3 ECC 1333/1066 in 24 DIMMs • 1/1 PCI-E 2.0 x16 and x8 (in x4) support left hand side riser card • 1 PCI-E 2.0 x8 (x4+x1+x1) support right hand side riser card • 4 G-bit LAN (2 Intel 82576 Kawela) • 6 SATA (3.0 Gb/s) • Winbond WPCM450 IPMI 2.0 Support (-F w/ Dedicated LAN) • Matrox G200eW Graphics (16MB) • 12.8” x 16.5”, 10-layer, (SC819, SC119, SC829, SC219)

  24. H8DGG-QF (GPU server) • Dual AMD Socket G34 6000 series Opteron (8/12 Core ready) • 3.2 GHz Hyper Transport (HT3) Link • 256 GB U/RDDR3 ECC 1333/1066 in 16 DIMMs • 1U: 2 GPU plus two IB QDR • 2U: 4 GPU plus one IB QDR • 2 G-bit LAN (Intel 82576 Kawela) • Winbond IPMI 2.0 support Applications: Video editing, Oil and Gas exploration, Medical, and Engineering intensive

  25. AOC-R1UG-IBQ

  26. H8DGT-H/-HFH8DGT-HIBQ/-HIBQF (2U Twin) • Dual AMD Socket G34 6000 series Opteron (8/12 Core ready) • 3.2 GHz Hyper Transport (HT3) Link • 256 GB U/RDDR3 ECC 1333/1066 in 16 DIMMs • Mellanox Connect-X IB w/ single QSFP connector support (H8DGT-HIBQ & H8DGT-HIBQF) • 2 G-bit LAN (Intel 82576 Kawela) • Winbond IPMI 2.0 support (H8DGT-HF & H8DGT-HIBQF) • 6.78” x 16.64”, 2U Twin (hot plug) (SC827, SC217) Applications: HPC, Data center, Quantum chemistry, Financial simulation, Genomics, and Astrophysics.

  27. H8SGL(-F) (UP Server) • Single AMD Socket G34 Opteron 6000 series (8/12 Core ready) • 2.6 GHz HyperTransport (HT3) Link • 128 GB U/RDDR3 ECC 1333/1066 in 8 DIMMs • 2 G-bit LAN (Intel 82574L) • Winbond WPCM450 IPMI 2.0 Support • 12” x 8”, ATX, 1U, 3U, 4U, and above (SC512, SC513, SC811, SC813m, SC111, SC113m, SC731, SC733, SC833, SC835, SC743, SC745) • Applications: ISP, Application server, Appliance server, General servers, Entry level server

  28. H8DG6/i(-F) (Server) • Dual AMD Socket G34 6000 series Opteron (8/12 Core ready) • Dual AMD SR5690 and SP5100 Chipset • 3.2 GHz HyperTransport (HT3) Link • Up to 256GB U/RDDR3 ECC 1333/1066 in 16 DIMMs • 3/1/2 PCI-E 2.0 x16/x8/x4 (in x8) • LSI 2008 SAS2 (H8DG6(-F) only) • 2 G-bit LAN (Intel 82576 Kawela) • 6 SATA (3.0 Gb/s) • 8 USB 2.0 support (2 rear, 4 header, 2 type A) • Winbond WPCM450 IPMI 2.0 Support (F version) • Matrox G200eW Graphics • 8 4-PIN PWM Fan & Speed control • 12” x 13”, EATX, 1U, 2U, 3U, 4U, and above

  29. H8SCM(-F) (UP Server) • Single AMD Socket C32 Opteron 4000 series (4/6 Core ready) • AMD SR5650/SP5100 Chipset • 2.6 GHz HyperTransport (HT3) Link • Up to 64 GB U/RDDR3 ECC 1333/1066/800 • 1/1/1/1 PCI-E 2.0 x8 in x16/x8/x4 in x8/PCI • 6 SATA (3.0Gb/s) • 2 G-bit LAN (Intel Hartwell 82574L) • Winbond WPCM450 IPMI 2.0 Support • Matrox G200 Graphics • 8 USB port s (2 rear, 2 Type-A, 2 headers-4 port) • 1 IDE 133 • 6-layer, 9.6” x 8.6”, Micro-ATX, SC512, SC513, SC811, SC813M, SC111, SC113M, SC731, SC733 29

  30. H8DCT/-FH8DCT-IBQ/-IBQF (1U Twin) QSFP COM VGA LAN 2 LAN 1 USB 3rd ALN NIC • Dual AMD Socket C32 4000 series Opteron (4/6 Core ready) • AMD SR5670/SP5100 Chipset • 3.2 GHz Hyper Transport (HT3) Link • Up to 128 GB U/RDDR3 ECC 1333/1066/800 in 12 DIMMs • 1 PCI-E 2.0 x16 • 4 SATA (3.0 Gb/s) • Matrox G200eW Graphics • Dual Gigabit LAN (Intel Kawela 82576) • Mellanox ConnectX IB QDR (IBQ(F) version only) • 5 USB (2 rear / 2 header / one type A) • Winbond IPMI 2.0 support (F version only) • 6.5” x 16.64”, 1U Twin (SC808 & SC809) IB PCI-E 2.0 x16 BMC Type A AMD SR5670 AMD SP5100 SATA x4 VRM Socket C32 CPU1 DDR3 DDR3 Socket C32 CPU2 4-pin PWR PWR PWR VRM 30

  31. IA MP Motherboard 31

  32. Boxboro-EX 4S MB MB MB MB MB MB MB MB MB MB MB MB MB MB MB MB Nehalem-EX Nehalem-EX • Connectivity • Fully-connected (4 Intel® QuickPath interconnects per socket) • 6.4, 5.86, or 4.8 GT/s on all links • Socket-LS • With 2 IOHs: 82 PCIe lanes (72 Gen2 Boxboro lanes + 4 Gen1 lanes on unused ESI port + 6 Gen1 ICH10 lanes) • Memory • CPU-integrated memory controller • Registered DDR3-1066 DIMMs running at speeds of 800, 978 or 1066 MHz via on-board memory buffer • 64 DIMM support (4:1 DIMM to buffer ratio) • Technologies & Enabling • Intel® Intelligent Power Node Manager • Virtualization: VT-x, VT-d, & VT-c • I/O: Intel® QuickData Technology with Niantic and Kawela Nehalem-EX Nehalem-EX Intel® QuickPath interconnects Boxboro Boxboro X4 ESI ICH 10* x8 x8 x8 x4 x8 x8 x8 x8 x4 x8 X4 PCIe Gen1 2x4 x16 x16 2x4 2x4 2x4 Intel & TPV RAID cards** Kawela /Niantic E-Net 3rd Party PCIe Devices 1 & 10GbE SATA/SAS IBA, PCIe SW, etc.

  33. Nehalem-EX Overview Key Features: Up to 8 cores per socket Intel® Hyper-Threading (2 threads/core) 24MB shared last level cache Intel® Turbo Boost Technology 45nm process technology Integrated memory controller Supports speeds of DDR3-800, 978 and 1066 MHz via a memory buffer (Mill Brook) Four full-width, bidirectional Intel® QuickPath interconnects 4.8, 5.86, or 6.4 GT/s CPU TDP: ~130W to ~95W Socket–LS (LGA 1567) 44 bits physical address and 48 bits virtual address C O R E 1 C O R E 2 C O R E 3 C O R E 4 C O R E 5 C O R E 6 C O R E 7 C O R E 8 24M Shared Last Level Cache Interconnect controller Integrated Memory Controller 4 Full-width Intel® QuickPath Interconnects 4 Intel® Scalable Memory Interconnects

  34. X8QB6/E-F • Quad Intel Nehalem-EX MP Xeon • Intel Boxboro-EX chipset • 256GB DDR3 Reg ECC in 32 DIMM • 2 PCI-E 2.0 x16 • or 1 PCI-E 2.0 x16 and 2 PCI-E 2.0 x8 or 4 PCI-E 2.0 x8 • LSI SASII 2108 for 8 ports SAS2 (HW RAID 0,1, 5, 6,10, 60) • IPMI/KVM with dedicated Lan • 6 SATA2 ports • Intel 82576 Dual Gigabit LAN • 4-Pin PWM Fan Speed control • 16” x 17” • Chassis; SC818TQ-1400B; SC748TQ-R1400B • Sample Now • Area of Focus: Virtualization, HPC, Database, Finance, Oil & Gas, University/Labs

  35. Networking Solution 35

  36. Dual-port Gigabit Ethernet • AOC-PG-i2+ • Proprietary Low-profile Form Factor • Intel® 82576EB • Two RJ45 Connectors • PCI-E x4 • VMDq, Jumbo Frames, iSCSI • Windows, Linux, VMWare, FreeBSD • AOC-SG-i2 • Standard Low-profile Form Factor • Intel® 82575EB • Two RJ45 Connectors • PCI-E x4 • VMDq, Jumbo Frames, iSCSI • Windows, Linux, VMWare, FreeBSD Available only as integrated solution with SMC server systems and motherboards

  37. Quad-port Gigabit Ethernet • AOC-UG-i4 • UIO Full-height Form Factor • Intel® 82571EB • Four RJ45 Connectors • PCI-E x8 • VMDq, Jumbo Frames • Windows, Linux, VMWare, FreeBSD • AOC-SG-i4 • Standard Low-profile Form Factor • Intel® 82576EB • Four RJ45 Connectors • PCI-E x8 • VMDq, Jumbo Frames, iSCSI • Windows, Linux, VMWare, FreeBSD Available only as integrated solution with SMC server systems and motherboards

  38. Dual-port 10 Gigabit Ethernet • AOC-UTG-i2 • UIO Full-height Form Factor • Intel® 82598EB • Two CX4 Connectors • PCI-E x8 • VMDq, Jumbo Frames, iSCSI • Windows, Linux, VMWare, FreeBSD • AOC-STG-i2 • Standard Low-profile Form Factor • Intel® 82598EB • Two CX4 Connectors • PCI-E x8 • VMDq, Jumbo Frames, iSCSI • Windows, Linux, VMWare, FreeBSD Available only as integrated solution with SMC server systems and motherboards

  39. Dual-port 10 Gigabit Ethernet • AOC-STGN-i2S • Standard Low-profile Form Factor • Intel® 82599EB • Two SFP+ Connectors • PCI-E x8 Gen. 2 • VMDq, Jumbo Frames, iSCSI • Windows, Linux, VMWare, FreeBSD Available only as integrated solution with SMC server systems and motherboards • AOC-EXPX9502FXSR • Standard Low-profile Form Factor • Intel® 82598EB • Two XFP Connectors • PCI-E x8 • VMDq, Jumbo Frames, iSCSI • Windows, Linux, VMWare, FreeBSD

  40. InfiniBand • AOC-UINF-m2 • UIO Low-profile Form Factor, PCI-E x8 Gen. 2 • Mellanox® ConnectX-2 DDR • Selectable 20Gb IB or 10GbE port • Two CX4 Connectors • 1us MPI Ping Latency • Virtual Protocol Interconnect (VPI) • AOC-UIBQ-m1 • UIO Low-profile Form Factor, PCI-E x8 Gen. 2 • Mellanox® ConnectX-2 QDR • Selectable 40Gb IB or 10GbE port • One QSFP Connector • 1us MPI Ping Latency • Virtual Protocol Interconnect (VPI) • AOC-UIBQ-m2 • UIO Low-profile Form Factor, PCI-E x8 Gen. 2 • Mellanox® ConnectX-2 QDR • Selectable 40Gb IB or 10GbE port • Two QSFP Connectors • 1us MPI Ping Latency • Virtual Protocol Interconnect (VPI)

  41. SSE-G24-TG4 and SSE-G48-TG4 New product line - enterprise class Ethernet switches Offer a full suite of advanced Ethernet switching features Up to four 10-Gbps “uplink ports” can connect to: 10-Gigabit Ethernet backbone networks Servers with 10-Gigabit Ethernet Can be “stacked” together to create an even larger capacity switch.   • Can be used as: • Top-of-rack aggregation switch, • Connect servers to server or servers to backbone network • Wiring closet aggregation switch, • Connect users to backbone network • Core switch for a small business or branch office.  • Connect users to users, users to backbone network, users to servers • Comprehensive management tools allow flexibility in configuration for easy deployment. • Command Line Interface, • Browser-based GUI 41

  42. Advantages • One-stop Shopping: . Compatibility . Qualification . Optimization . Support . Service • Long Life Cycle • Flexibility and Upgradeability: . Compact size design . Wide range of offerings • Low power consumption: most cards consume between 3.5W to 12W • Optimized for wide-range of applications such as HPC, Storage, Datacenter, Workstations, etc. • Cost Effective: up to 70% “street price” advantage over leading competitive products with comparable features

  43. X9 Motherboard Roadmap

  44. Server Platform Transitions BricklandIvy Bridge-EX 2,4-8S+ Boxboro Nehalem-EXWestmere-EX Data Demanding Enterprise RomleySandy Bridge-EX(Socket-R) 4S Blades/HPC RomleySandy Bridge-EP(Socket-R) Mainstream Data Center Infrastructure TylersburgNehalem-EP 2S 1S RomleySandy Bridge-EN(Socket-B2) TylersburgNehalem-EP Cost Optimized/ Small FF 2S Entry 2S Premium 1S RomleySandy Bridge-EN(Socket-B2) TylersburgNehalem-EP 2S 1S (6 DIMM) FoxhollowLynnfield/Clarkdale BromolowSandy Bridge-DT(Socket-H2) Entry 1S 1S (4 DIMM)

  45. Romley EN, EP Platforms Sandy Bridge CPU Sandy Bridge CPU Memory DDR3 & DDR3L RDIMMs & UDIMMs, LR DIMMs Socket R: 4 channels per socket, up to 3 DPC; speeds up to DDR3 1600 Socket B2: 3 channels per socket, up to 2 DPC; speeds up to DDR3 1600 QPI Socket R: 2 QPI links Socket B2: 1 QPI link Sandy Bridge CPUs Socket R: Up to 8 cores / socket Socket B2: Up to 8 cores / socket DDR3 DDR3 QPI DDR3 DDR3 Intel®LOM Options 1GbE: Hartwell (1 port)Kawela (dual port)Barton Hills (4 port) 10GbE: Niantic Manageability Node Manager Data Center Manager Intel® Active Management Technology (for WS) QPI DDR3 DDR3 DDR3 DDR3 PCIe3 x8 PCIe3 x8 PCIe3 x8 PCIe3 x8 PCIe3 x8 PCIe3 x8 PCIe3 x8 PCIe3 x8 PCIe3 x8 PCIe3 x8 PCIe2 x4 DMI2 PCI Express* 3.0 Socket R: 40 lanes per socket Socket B2: 24 lanes per socket Extra Gen 2 x4 on 2nd CPU Patsburg Patsburg Optimized Server & WS PCH Integrated Storage: Up to 8 ports 6Gb/s SAS RAID 5 optional

  46. Patsburg Overview Dedicated server PCH supporting high-speed SATA, SAS, and advanced storage features of Xeon® servers Supports Cougar Point features, except Pixel Link (Gfx), C-Link, and Integrated clock, plus: 6Gb/s SAS SATA 6Gb/s PCI Express* Gen3 Uplink (-D & -T SKUs only) Same package dimensions as Cougar Point† LAN PHY 1xGbE LAN PHY LAN PHY Express card SPI Flash SPI Flash Super I/O PCI CODEC CODEC CODEC HD Audio WLAN x8 x8 Sandy Bridge - EP Sandy Bridge - EP QPI DDR3 DDR3 QPI x4 PCIe Gen3 for SAS: – D –T x4 DMI Gen2 Intel Patsburg -A/-B/-D/-T 27x27mm Serial Attached SCSI (SAS) 4 ports, 6Gb/s NV SRAM –T only 14x2.0 NVSRAM Ctrl. 4x3G 2x6G • 4 Patsburg SKUs and storage options:† • Entry (-A): • 4 ports of SCU (SATA 6Gb/s support only) • Basic (-B): • Adds 6Gb/s SAS support • Performance (-D): • Adds an additional 4 ports of 6Gb/s SCU SATA or SAS (total of 8); PCIe Gen 3 uplink to CPU • Premium RAID (-T) : • Adds support for SW RAID 5 on SCU ports • AHCI RAID 0/1/10/5 included with all SKUs • SCU RAID 0/1/10 included with all SKUs • SCU RAID 5 optional (requires –T SKU) 8 ports on –D –T SM Bus 2.0 GPIO GPIO x8 PCIe Gen2 LPC I/F TPM 1.2 TPM 1.2 Super I/O Super I/O

  47. SUPER X9DR6(F)/i(F) CPU1 BMC Barton Hill-2 • Dual Sandy Bridge EP (Socket R) • Patsburg-A • QPI up to 8.0GT/s • 16 DIMM, 256GB Reg. ECC DDR3 up to 1600MHz • 4 PCI-E 3.0 x 16 • 1 PCI-E 3.0 x8 in x16 • 1 PCI-E 3.0 x4 in x8 slot • 8 port SAS2 from RAID Key (6(F)) • IPMI/KVM-F Version • 4 SATA2 & 2 SATA3 ports • USB Type A connector • Intel Barton Hill Dual Gigabit LAN, • 4 pin PWM Fan Speed control • 12” x 13”, 1U and up PCI-e3.0 x16 PCI-e 3.0 x4 PCI-e 3.0 x16 PCI-e 3.0 x16 PCI-e3.0 x16 PCI-e 3.0 x8 in x16 x16 x8 CPU2 x16 x16 PWR x4 x4 x1 SATA x6 x16 PWR PCH-A x4 X4 ESI PWR SAS 0~3 SAS 4~7

  48. Super X9SRE-6 /-6F /-6LN4 /-6T 8-pin 24-pin Power LAN x2 LAN x2 • Support Sandy Bridge EP, 6 or 8 core processor, Socket R/LGA 2011 Socket • Intel® Patsburg –D or-T Chipset • DDR3 up to 1600MHz (by CPU) • Up to 256GB ECC RDIMM or 64GB non-ECC UDIMM. • 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 in x16 slot • 1 PCI-E 2.0 x4 in x16 slot, 3 PCI-X 64bit slots. • 8 SAS/SATA 6Gb RAID 0,1,10 RAID 5 Option, 2 SATA 6Gb/s, RAID 0,1, 5,10 and 4 SATA 3Gb/s • Intel Powervill Dual Port Gbit LAN. (X9SRE-6 /-6F) • 2 Intel Powervill Dual Port Gbit LAN. (X9SRE-6LN4) • Intel Twinvill Dual Port 10 Gbit LAN. (X9SRE-6T) • 10 USB 2.0 (2 rear, 6 by headers, 2 Type-A) • 2x Serial Port (1 rear, 1 Header) • 6 4-pin PWM FAN Connectors. • DOM (Disk on Module) Power Connector Support. • TPM 1.2 20-pin Header. 12” x 9.6 ” ATX, VGA COM 1 USBIPMI PS2 Power -vill SIO BMC Power -vill COM 2 X8 X4 PCI-E 2.0 x4 in x16 PCI-E 3.0 x16 PCI-E 3.0 x8 in x16 PCI-X 100/133 PCI-X 100/133 PCI-X 100/133 USB Sandy Bridge EP Socket R LGA 2011 USB USB X16 X8 BIOS x4 x4 for SAS 8x SATA6Gb Patsburg -D/-T PCI-X x4 2x SATA 6Gb Type-A Type-A 4x SATA 3Gb Front Panel SMC Confidential

  49. Super X9SRi-6 /-6F /-6LN4 /-6T 8-pin 24-pin Power LAN x2 LAN x2 • Support Sandy Bridge EP, 6 or 8 core processor, Socket R/LGA 2011 Socket • Intel® Patsburg –D or-T Chipset • DDR3 up to 1600MHz (by CPU) • Up to 256GB ECC RDIMM or 64GB non-ECC UDIMM. • 1 PCI-E 3.0 x16 • 1 PCI-E 3.0 x8 in x16 slot. • 8 SAS/SATA 6Gb RAID 0,1,10 RAID 5 Option, 2 SATA 6Gb/s, RAID 0,1, 5,10 and 4 SATA 3Gb/s • Intel Powervill Dual Port Gbit LAN. (X9SRi-6 /-6F) • 2 Intel Powervill Dual Port Gbit LAN. (X9SRi-6LN4) • Intel Twinvill Dual Port 10 Gbit LAN. (X9SRi-6T) • 10 USB 2.0 (2 rear, 6 by headers, 2 Type-A) • 2x Serial Port (1 rear, 1 Header) • 6 4-pin PWM FAN Connectors. • DOM (Disk on Module) Power Connector Support. • TPM 1.2 20-pin Header. 12” x 9.6 ” ATX, • 1U/2U optimized server MB. VGA COM 1 USBIPMI PS2 Power -vill SIO BMC Power -vill COM 2 X8 X4 PCI-E 3.0 x16 PCI-E 3.0 x8 in x16 USB Sandy Bridge EP Socket R LGA 2011 USB USB X16 X8 BIOS x4 for SAS Patsburg -D/-T 8x SATA6Gb 2x SATA 6Gb Type-A Type-A 4x SATA 3Gb Front Panel SMC Confidential

  50. Super X9SRG-F LAN LAN COM VGA USBIPMI PS2 • Sandy Bridge-EP, Socket R, LGA2011 • Patsburg-D PCH (Romley) • 1600/1333/1066/800 MHz Memory • DDR3 in 4 Channels, 2 DIMMs / Channel • Up to 256 GB RDIMM or 96GB UDIMM • 2 PCI-E 3.0 x16 for 2 GPU Card optimized • 1 PCI-E 2.0 x8 • 4 SATA 3 Gb/s and 2 SATA 6Gb Port • 4 SAS/SATA 6Gb Ports • Intel Dual Gb LAN by Powervill. • Integrated IPMI 2.0 with Dedicated LAN (-F only) • 6 USB (2 rear, 4 via 2 headers) • 7.71” x 16.64 ” Form Factor • DOM (Disk on Module) Power Connector Support. • TPM 1.2 20-pin Header. • 1U, Dual GPU Optimized Solution COM P.V LAN SIO PHY PCI-E 2.0 X8 PCI-E 3.0 X16 PCI-E 3.0 X16 BMC x4 CMOS x16 Patsburg -B x8 USB x16 USB x4 Power Conneror SATA SAS/SATA 6Gb Sandy Bridge EP Socket R LGA 2011

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