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Three Dimensional Circuit Board TechnologyPowerPoint Presentation

Three Dimensional Circuit Board Technology

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Three Dimensional Circuit Board Technology David Perreault MIT IdeaStream April 8, 2004 Background Printed Circuit Boards (PCBs) form the backbone of most electronic systems $30B/yr market

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Presentation Transcript

Background

- Printed Circuit Boards (PCBs) form the backbone of most electronic systems
- $30B/yr market

- Traditionally provide mechanical support and medium-density electrical interconnections among components
- Copper foil is bonded to an insulator (laminate) and etched to form planar interconnect patterns
- Multilayer boards are fabricated by stacking up layers
- Holes are drilled and plated to interconnect layers

- Planar interconnections
- Pattern resolution is typically > 0.1 mm
- Copper thickness 0.018 mm – 0.18 mm

PCB Functionality

- Printed circuit boards have taken on increasing degrees of functionality in modern circuit applications, e.g.:
Busbars Heatsinking

Magnetic windings

Conventional PCBs are not very effective for these functions

Three-Dimensional Circuit Boards

- We are exploiting the third dimension to enable improved functionality: 3DPCBs
- Component heights are typically ~1 mm+, so heights up to 1 mm are often “free”

- Simple vertical patterns enable many important functions to be better realized
- Heat sinks
- Busbars
- Magnetic windings
- EMI shielding
- Waveguides and resonators

Three-Dimensional Patterning

- To build in the third dimension, we employ photosensitive epoxies to form “molds” and “scaffolds”
- Photolithography used to pattern 3D structures
- Conductors plated onto the structures
- Additional photolithography steps may be added for further patterning

- Fabrication techniques and materials are largely compatible with existing processes
- Photolithography
- Electroplating
- Etching

(b)

(d)

(c)

MIME Fabrication Method(magnetic winding example)- Copper is electroplated into a 3D Mold
- The mold can be removable with additional steps

Scaffold Fabrication Method(heat sink example)

- The patterned epoxy forms a 3D scaffold
- Copper is deposited, patterned, and electroplated

1.2 mm deep wells of 1.5 mm diameter

Three-Dimensional Circuit Board Structure (1.2 mm high)Summary

- Printed Circuit Boards (PCBs) form the backbone of most electronic systems
- Planar interconnects
- Limited functionality

- Three-Dimensional Circuit Boards (3DCBs) offer advantages for many common functions
- Busbars, windings, heat sinks, EMI shields, waveguides

- Fabrication methods are proposed for effective 3DCBs
- Methods and materials are compatible with existing PCB processes

- Results to date support the viability of 3DCBs

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